IP Library › Granted Patent US 12,441,860
Granted Patent B2
US 12,441,860 · App. 18/569,292 · Granted Oct 14, 2025

Polypropylene-based resin expanded bead, method for producing same, and molded article of polypropylene-based resin expanded beads

Inventors: Takumi Sakamura (Tochigi, JP); Hajime Ohta (Tochigi, JP)
Assignee: JSP CORPORATION
C08J9/228B29B9/12C08J9/18B29K2023/12B29K2105/046B29K2105/048B29K2995/0082C08J2205/052C08J2323/14
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Quick Facts
Patent No.
US 12,441,860
App. No.
18/569,292
Granted
Oct 14, 2025
Kind
B2
Abstract

A polypropylene-based resin expanded bead having a tubular shape with a through-hole, containing a foamed core layer constituted by a polypropylene-based resin and a fusion-bonding layer covering the foamed core layer. An average hole diameter d of the through-hole in the expanded bead is less than 1 mm, and a ratio d/D of the average hole diameter d to an average outer diameter D of the expanded bead is 0.4 or less, a mass ratio of the foamed core layer and the fusion-bondable layer is foamed core layer:fusion-bondable layer=99.5:0.5 to 85:15, and the polypropylene-based resin constituting the foamed core layer has a flexural modulus of 800 MPa or more and less than 1200 MPa and a melting point Tmc of 150° C. or lower.

Claims (25)

1. A polypropylene-based resin expanded bead having a tubular shape with a through-hole, comprising:

a foamed core layer constituted by a polypropylene-based resin; and

a fusion-bondable layer covering the foamed core layer,

wherein

an average hole diameter d of the through-hole in the expanded bead is less than 1 mm, and a ratio d/D of the average hole diameter d to an average outer diameter D of the expanded bead is 0.4 or less,

a mass ratio of the foamed core layer and the fusion-bondable layer is foamed core layer:fusion-bondable layer=99.5:0.5 to 85:15, and

the polypropylene-based resin constituting the foamed core layer has a flexural modulus of 800 MPa or more and less than 1200 MPa and a melting point Tmc of 150° C. or lower.

2. The polypropylene-based resin expanded bead according to claim 1 , wherein a circularity of the through-hole is 0.90 or more in a cross-section of the expanded bead in a direction perpendicular to a penetration direction of the through-hole.

3. The polypropylene-based resin expanded bead according to claim 1 , wherein a ratio of an apparent density to a bulk density of the expanded bead is 1.7 or more and 1.9 or less.

4. The polypropylene-based resin expanded bead according to claim 1 , wherein an average outer diameter D of the expanded bead is 2 mm or more and 5 mm or less.

5. The polypropylene-based resin expanded bead according to claim 1 , wherein an average wall thickness t of the expanded bead, which is represented by the following formula (I), is 1.2 mm or more and 2 mm or less:

average wall thickness t =(the average outer diameter D −the average hole diameter d )/2  (I).

6. The polypropylene-based resin expanded bead according to claim 1 , wherein a closed cell content of the expanded bead is 90% or more.

7. The polypropylene-based resin expanded bead according to claim 1 , wherein the fusion-bondable layer is constituted by a polyolefin-based resin, and a melting point of the polyolefin-based resin constituting the fusion-bonding layer is lower than a melting point of the polypropylene-based resin constituting the foamed core layer.

8. The polypropylene-based resin expanded bead according to claim 1 , wherein an apparent density of the expanded bead is 10 kg/m 3 or more and 100 kg/m 3 or less.

9. A molded article of polypropylene-based resin expanded beads formed by in-mold molding the polypropylene-based resin expanded beads according to claim 1 ,

wherein an open cell content of the molded article of expanded beads is 2.5% or more and 12% or less.

10. A method for producing a polypropylene-based resin expanded beads, comprising:

dispersing multilayer resin particles each having a tubular shape with a through-hole in a dispersion medium in a sealed container;

impregnating the multilayer resin particles dispersed in the dispersion medium with a blowing agent; and

producing expanded beads by expanding the multilayer resin particles containing the blowing agent, wherein

the multilayer resin particles each have a core layer constituted by a polypropylene-based resin and a fusion-bondable layer covering the core layer,

an average hole diameter dr of the through-holes in the multilayer resin particles is less than 0.25 mm, and a ratio dr/Dr of the average hole diameter dr to an average outer diameter Dr of the multilayer resin particles is 0.4 or less,

a mass ratio of the core layer and the fusion-bondable layer in the multilayer resin particles is core layer:fusion-bondable layer=99.5:0.5 to 85:15, and

the polypropylene-based resin constituting the core layer has a flexural modulus of 800 MPa or more and less than 1200 MPa, and a melting point Tmrc of 150° C. or lower.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 12, 2023
From: SAKAMURA, TAKUMI; OHTA, HAJIME
To: JSP CORPORATION
Reel/Frame 065840/0367 →
Priority Claims (1)
JP 2021-105922 · Jun 25, 2021 · national
Continuity (1)
Related Publication 20240279421A1 · Aug 22, 2024
References Cited (51)
US 7678839B2 · Sasaki · 2010 [cited by applicant]
US 8518540B2 · Sakaguchi et al. · 2013 [cited by applicant]
US 8592495B2 · Shima et al. · 2013 [cited by applicant]
US 9611369B2 · Sato et al. · 2017 [cited by applicant]
US 10882970B2 · Nakamoto · 2021 [cited by applicant]
US 11732101B2 · Shimada · 2023 [cited by examiner]
US 20060223897A1 · Sasaki · 2006 [cited by applicant]
US 20120100376A1 · Sakaguchi et al. · 2012 [cited by applicant]
US 20120115968A1 · Shima et al. · 2012 [cited by applicant]
US 20150057387A1 · Sato et al. · 2015 [cited by applicant]
US 20170369669A1 · Yoshida · 2017 [cited by examiner]
US 20180215891A1 · Kitahara · 2018 [cited by examiner]
US 20200032023A1 · Nakamoto · 2020 [cited by applicant]
US 20200181351A1 · Bailey et al. · 2020 [cited by applicant]
US 20220235216A1 · Takagi et al. · 2022 [cited by applicant]
US 20230074915A1 · Shimada · 2023 [cited by examiner]
EP 2653283A1 · 2013 [cited by applicant]
EP 3309197A1 · 2018 [cited by applicant]
EP 4234223A1 · 2023 [cited by applicant]
JP 08108441A · 1996 [cited by examiner]
JP H08108441A · 1998 [cited by examiner]
JP 11247322A · 1999 [cited by applicant]
JP 2000129028A · 2000 [cited by applicant]
JP 2003039565A · 2003 [cited by applicant]
JP 2006307177A · 2006 [cited by applicant]
JP 2012102201A · 2012 [cited by applicant]
JP 2014040507A · 2014 [cited by applicant]
JP 2018131620A · 2018 [cited by applicant]
KR 100226300B1 · 1999 [cited by applicant]
KR 1020060105475A · 2006 [cited by applicant]
KR 1020120058503A · 2012 [cited by applicant]
KR 1020170105487A · 2017 [cited by applicant]
TW 201114816A · 2011 [cited by applicant]
TW 202106778A · 2021 [cited by applicant]
WO WO2010150466A1 · 2010 [cited by applicant]
WO WO2013137344A1 · 2013 [cited by applicant]
WO WO2018225649A1 · 2018 [cited by applicant]
WO WO2020235290A1 · 2020 [cited by applicant]
WO WO2022091750A1 · 2022 [cited by applicant]
Translation of JPH08108441A (Year: 1998). [cited by examiner]
Indonesian Office Action issued Feb. 24, 2025 in Indonesian Patent Application No. P00202400265 with English Machine translation, 6 pgs. [cited by applicant]
Extended European Search Report issued Sep. 3, 2024 in European Application No. 22828343.8, 7 pgs. [cited by applicant]
International Search Report issued Sep. 6, 2022 in PCT/JP2022/024274, filed on Jun. 17, 2022, 3 pages. [cited by applicant]
Notice of Reasons for Refusal issued in the corresponding Japanese Patent Application No. 2022-568982, 4 pages (with English Translation). [cited by applicant]
Decision to Grant issued in the corresponding Japanese Patent Application No. 2022-568982, 5 pages (with English Translation). [cited by applicant]
Written Opinion issued on Sep. 6, 2022 in PCT/JP2022/024274 (filed Jun. 17, 2022), 3 pgs. [cited by applicant]
Office Action received May 12, 2025, in Brazilian Patent Application No. BR112023026687-4 (with English translation). [cited by applicant]
Office Action received on Jul. 14, 2025, in corresponding Indonesian Patent Application No. P00202400265 with English translation. [cited by applicant]
Office Action received on Jul. 14, 2025, in corresponding Taiwanese Patent Application No. 111123389 (with English machine translation). [cited by applicant]
Office Action issued on Jul. 11, 2025 in Brazilian Patent Application No. BR112023026687-4 (with English machine translation). [cited by applicant]
Office Action issued on Aug. 19, 2025 in Korean Patent Application No. 10-2024-7002572 (with English machine translation), citing references 15-18. [cited by applicant]