IP Library › Granted Patent US 11,732,101
Granted Patent B2
US 11,732,101 · App. 17/790,997 · Granted Aug 22, 2023

Polypropylene-based resin expanded beads and polypropylene-based resin expanded beads molded article

Inventors: Tomohito Shimada (Utsunomiya, JP); Hajime Ohta (Utsunomiya, JP)
Assignee: JSP CORPORATION
C08J9/16B32B1/00B32B5/18B32B27/065B32B27/32C08J9/224C08J9/228B32B2266/025B32B2307/72C08J2323/12C08J2423/12
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Quick Facts
Patent No.
US 11,732,101
App. No.
17/790,997
Granted
Aug 22, 2023
Kind
B2
Abstract

An expanded bead having a through hole and including a foamed core layer which defines the through hole therein and which is constituted of a resin composition containing two kinds of polypropylene-based resins having different melting points, and a cover layer covering the foamed core layer and constituted of a polyolefin-based resin. The expanded bead gives a DSC curve in which an endothermic peak intrinsic to the resin composition and another endothermic peak on a higher temperature side thereof appear in a specific heat of fusion ratio. Molded articles include a multiplicity of the expanded beads.

Claims (14)

1. An expanded bead having a through hole, said expanded bead comprising a foamed core layer that defines the through hole therein and that includes a polypropylene-based resin composition, and a cover layer that covers the foamed core layer and that includes a polyolefin-based resin,

wherein said polypropylene-based resin composition comprises 70 to 97% by weight of a polypropylene-based resin PP1 having a melting point of higher than 140° C. and not higher than 150° C., and 3 to 30% by weight of a polypropylene-based resin PP2 having a melting point of not lower than 145° C. and not higher than 160° C., provided that a total amount of the resin PP1 and the resin PP2 is 100% by weight,

wherein a difference between the melting point of the polypropylene-based resin PP2 and the melting point of the polypropylene-based resin PP1 [(melting point of PP2)−(melting point of PP1)] is not smaller than 5° C. and smaller than 15° C.,

said expanded bead having such a crystal structure that gives a first time DSC curve when measured by heat flux differential scanning calorimetry in which said expanded bead is heated from 30° C. to 200° C. at a heating rate of 10° C./min,

wherein said first time DSC curve has a main endothermic peak intrinsic to the polypropylene-based resin composition and a high temperature-side endothermic peak which is located on a higher temperature side of the main endothermic peak,

wherein said high temperature-side endothermic peak has a heat of fusion of 12 to 20 J/g, and

wherein a ratio of a heat of fusion of said main endothermic peak to the heat of fusion of said high temperature-side endothermic peak is 3.5 or greater.

2. The polypropylene-based resin expanded bead according to claim 1 , wherein the melting point of the polypropylene-based resin PP1 is higher than 140° C. and not higher than 145° C. and the melting point of the polypropylene-based resin PP2 is not lower than 150° C. and not higher than 155° C.

3. The polypropylene-based resin expanded bead according to claim 1 , wherein the polypropylene-based resin PP2 has a melt flow rate (MFR) of 2 to 18 g/10 min at 230° C. and a load of 2.16 kg.

4. The polypropylene-based resin expanded bead according to claim 1 , wherein the polypropylene-based resin PP1 and the polypropylene-based resin PP2 are each a polypropylene-based resin that is obtained by polymerization using a Ziegler-Natta catalyst.

5. The polypropylene-based resin expanded bead according to claim 1 , having a bulk density of 15 to 50 kg/cm 3 .

6. The polypropylene-based resin expanded bead according to claim 1 , having an average outer diameter D [mm], an average hole diameter d [mm] of the through hole and an average wall thickness t [mm] which is defined as (D−d)/2,

wherein t is 0.8 to 2 mm and t/d is 0.4 to 1.

7. A polypropylene-based resin expanded beads molded article comprising a multiplicity of the expanded beads according to claim 1 that are fusion-bonded to each other, said expanded beads molded article being formed with interconnected voids and having a voidage of 20% or more.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 6, 2022
From: SHIMADA, TOMOHITO; OHTA, HAJIME
To: JSP CORPORATION
Reel/Frame 060408/0349 →
Priority Claims (1)
JP 2020-017127 · Feb 4, 2020 · national
Continuity (1)
Related Publication 20230074915A1 · Mar 9, 2023
Cited By (1)
US 12,441,860