Integrated tunable filter architecture
An apparatus and method for a frequency based integrated circuit that selectively filters out unwanted bands or regions of interfering frequencies utilizing one or more tunable notch or bandpass filters or tunable low or high pass filters capable of operating across multiple frequencies and multiple bands in noisy RF environments. The tunable filters are fabricated within the same integrated circuit package as the associated frequency based circuitry, thus minimizing R, L, and C parasitic values, and also allowing residual and other parasitic impedance in the associated circuitry and IC package to be absorbed and compensated.
1. An integrated circuit configuration including:
a) a frequency-based circuit having a common signal path;
b) at least one tunable filter coupled to the common signal path of the frequency-based circuit, wherein each tunable filter is configured to be selectively activated to filter unwanted frequencies from the common signal path of the frequency-based circuit; and
c) at least one bypassable compensation capacitor circuit, each coupled in parallel with a corresponding tunable filter and configured to match and substitute for an effective capacitance of such tunable filter when such tunable filter is not activated;
wherein the frequency-based circuit and each tunable filter are co-designed to absorb and compensate for residual and other parasitic impedances present in the integrated circuit configuration.
2. The integrated circuit package of claim 1 , wherein at least one tunable filter includes at least one of a tunable notch filter or a tunable bandpass filter.
3. The integrated circuit package of claim 2 , wherein the tunable notch filter or tunable bandpass filter includes a tunable RLC filter.
4. The integrated circuit package of claim 1 , wherein at least one tunable filter includes at least one of a tunable low pass filter or a tunable high pass filter.
5. The integrated circuit package of claim 4 , wherein the tunable low pass filter or tunable high pass filter includes a tunable RLC filter.
6. The integrated circuit package of claim 1 , wherein the frequency-based circuit is at least one of a radio frequency switch, a radio frequency duplexer, or a radio frequency diplexer.
7. The integrated circuit package of claim 1 , wherein at least one tunable filter includes multiple selectable fixed frequency notch filters.
8. The integrated circuit package of claim 1 , wherein at least one tunable filter is selectively settable to a minimum filtering state when its filtering function is not needed.
9. The integrated circuit package of claim 1 , wherein the co-designed frequency-based circuit and at least one tunable filter have a total insertion loss that is less than the total insertion loss that would exist if such tunable filter was external to the integrated circuit package.
10. The integrated circuit package of claim 1 , wherein the frequency-based circuit is fabricated on a first integrated circuit die encased by the integrated circuit package, and at least one tunable filter is fabricated on a second integrated circuit die encased by the integrated circuit package, the second integrated circuit die being electrically connected to the first integrated circuit die.
11. An integrated circuit configuration for selectively filtering unwanted frequencies from a signal path of a frequency-based circuit, including:
a) a frequency-based circuit having a common signal path;
b) at least one tunable filter coupled to the common signal path of the frequency-based circuit, for selectively filtering unwanted frequencies from the common signal path of the frequency-based circuit; and
c) at least one bypassable compensation capacitor circuit, each coupled in parallel with a corresponding tunable filter and configured to match and substitute for an effective capacitance of such tunable filter when such tunable filter is not activated;
wherein the frequency-based circuit and each tunable filter are co-designed to absorb and compensate for residual and other parasitic impedances present in the integrated circuit configuration.
12. The integrated circuit package of claim 11 , wherein at least one tunable filter includes at least one of a tunable notch filter or tunable bandpass filter for selectively filtering a relatively narrow range of frequencies on the signal path of the frequency-based integrated circuit.
13. The integrated circuit package of claim 12 , wherein the tunable notch filter or tunable bandpass filter includes a tunable RLC filter.
14. The integrated circuit package of claim 11 , wherein at least one tunable filter includes at least one of a tunable low pass filter or a tunable high pass filter for selectively filtering out unwanted frequencies from the signal path of the frequency-based integrated circuit.
15. The integrated circuit package of claim 14 , wherein the tunable low pass filter or tunable high pass filter includes a tunable RLC filter.
16. The integrated circuit package of claim 11 , wherein the frequency-based circuit is at least one of a radio frequency switch, a radio frequency duplexer, or a radio frequency diplexer.
17. The integrated circuit package of claim 11 , wherein at least one tunable filter includes multiple selectable fixed frequency notch filter for selectively filtering out a relatively narrow range of unwanted frequencies from the signal path of the frequency-based integrated circuit.
18. The integrated circuit package of claim 11 , wherein at least one tunable filter is selectively settable to a minimum filtering state when its filtering function is not needed.
19. The integrated circuit package of claim 11 , wherein the frequency-based circuit and at least one tunable filter have a total insertion loss that is less than the total insertion loss that would exist if such tunable filter was external to the integrated circuit package.
20. The integrated circuit package of claim 11 , wherein the frequency-based circuit is fabricated on a first integrated circuit die encased by the integrated circuit package, and at least one tunable filter is fabricated on a second integrated circuit die encased by the integrated circuit package, the second integrated circuit die being electrically connected to the first integrated circuit die.