IP Library Granted Patent US 12,725,902
Granted Patent B2
US 12,725,902 · App. 18/604,603 · Granted Sep 1, 2026

Thermal management for RF transparent systems

Inventors: Cole R. Davis (Bloomington, IN); Manda Shaeffer (Bloomington, IN)
Assignee: The United States of America, as represented by the Secretary of the Navy
H01Q1/02H01Q1/422
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Quick Facts
Patent No.
US 12,725,902
App. No.
18/604,603
Granted
Sep 1, 2026
Kind
B2
Abstract

Provided are apparatus and methods for providing thermal management for RF transparent systems. In particular, a layered composite is provided that includes a first thermally conductive and RF transparent layer along with a second RF transparent system structural layer. The system also includes an attached heat sink(s) to reduce the effective operating temperature of the underlying materials in the RF transparent system such as the thermally conductive layer. Accordingly, the use of this thermal management system allows for the use of more conventional, lower-temperature RF transparent system materials in subsequent layers. Additionally, reducing the operating temperature with the thermally conductive layer and heat sink improves the RF transparency in the RF transparent system.

Claims (31)

1 . An apparatus for thermal management of a radio frequency (RF) transparent system comprising:

a first thermally conductive RF transparent layer; and

a second RF transparent material layer disposed next to and in contact with the first thermally conductive RF transparent layer;

wherein the first thermally conductive RF transparent layer is placed to reduce an operating temperature of the second RF transparent material layer and thereby protect the second RF transparent material layer from heat exposure.

2 . The apparatus of claim 1 , further comprising:

one or more heat sink devices thermally coupled to the first thermally conductive RF transparent layer and configured to remove heat from the RF transparent system.

3 . The apparatus of claim 2 , further comprising an active thermal management system capable of receiving heat measurement feedback and configured to actively control cooling of the one or more heat sink devices.

4 . The apparatus of claim 2 , wherein each of the one or more heat sink devices comprise a heat conductive coupling with the first layer and a finned heat sink thermally coupled with the heat conductive coupling.

5 . The apparatus of claim 1 , wherein the first thermally conductive RF transparent layer has anisotropic thermal conductivity.

6 . The apparatus of claim 1 , wherein the first thermally conductive RF transparent layer further has orthotropic thermal conductivity.

7 . The apparatus of claim 1 , wherein the first thermally conductive layer RF transparent comprises one or more of boron nitride nanotubes (BNNTs) and BNNT fibers.

8 . The apparatus of claim 1 , wherein the first thermally conductive RF transparent layer comprises a plurality of layers including:

a first layered material comprising ceramic or polymer material and possessing a first thermal conductivity; and

one or more subsequent second layered materials comprising ceramic or polymer material and possessing at least one of:

(1) a second thermal conductivity lower than the first thermal conductivity; or

(2) various levels and length-scales of porosity.

9 . A thermally managed radio frequency (RF) transparent system comprising:

a first thermally conductive RF transparent layer;

a second RF transparent material layer disposed next to and in contact with the first thermally conductive RF transparent layer; and

one or more heat sink devices thermally coupled to the first thermally conductive RF transparent layer and configured to remove heat from the RF transparent system;

wherein the first thermally conductive RF transparent layer is placed to protect the second RF transparent material layer from heat exposure.

10 . The system of claim 9 , further comprising an active thermal management system capable of receiving heat measurement feedback and configured to actively control cooling of the one or more heat sink devices.

11 . The system of claim 10 , wherein each of the one or more heat sink devices comprise a heat conductive coupling with the first layer and a finned heat sink thermally coupled with the heat conductive coupling.

12 . The system of claim 9 , wherein the first thermally conductive RF transparent layer has anisotropic thermal conductivity.

13 . The system of claim 9 , wherein the first thermally conductive RF transparent layer comprises a material having orthotropic thermal conductivity.

14 . The system of claim 9 , wherein the first thermally conductive layer RF transparent comprises one or more of boron nitride nanotubes (BNNTs) and BNNT fibers.

15 . The system of claim 9 , wherein the first thermally conductive RF transparent layer comprises a plurality of layers including:

a first layered material comprising ceramic or polymer material and possessing a first thermal conductivity; and

one or more subsequent second layered material comprising ceramic or polymer material and possessing at least one of:

(1) a second thermal conductivity lower than the first thermal conductivity; or

(2) various levels and length-scales of porosity.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2024
From: DAVIS, COLE R.; SCHAEFFER, MANDA
To: THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY
Reel/Frame 066769/0186 →
Continuity (3)
Provisional Application 63462696 · Apr 28, 2023
Provisional Application 63452016 · Mar 14, 2023
Related Publication 20240313387A1 · Sep 19, 2024
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