Thermal conductivity probe
This invention relates generally to a thermal conductivity probe. In one embodiment, a thermal conductivity probe includes, but is not limited to, at least one heating element, at least one thermal insulator, and at least one thermistor thermally isolated from the at least one heating element by the at least one thermal insulator.
1 . A probe comprising:
a cone penetration head configured to obtain cone penetration testing (CPT) data;
at least one heating element;
a plurality of temperature sensors, the plurality of temperature sensors being thermally insulated within the probe from the at least one heating element; and
at least one processor configured to determine thermal conductivity of material around the probe based on a mean time to rise to a specified temperature gain over ambient as measured using the plurality of temperature sensors.
2 . The probe of claim 1 , wherein the cone penetration head includes one of more of the following types of sensors: pore pressure or friction.
3 . The probe of claim 1 , wherein the processor is further configured to:
activate the at least one heating element;
detect a temperature gain above ambient using the plurality of temperature sensors;
deactivate the at least one heating element in response to the temperature gain above ambient; and
determine thermal conductivity based on a temperature decay profile.
4 . The probe of claim 1 , wherein the at least one heating element comprises a plurality of heating elements.
5 . The probe of claim 1 , wherein the plurality of temperature sensors are thermally insulated using one or more of the following materials: PI, PEEK, PPS, PEI, or PTFE.
6 . The probe of claim 1 , wherein the cone penetration head is removably coupled to the probe.
7 . A probe attachment device comprising:
at least one heating element;
a plurality of temperature sensors, the plurality of temperature sensors being thermally insulated within the probe attachment device from the at least one heating element; and
at least one processor configured to determine thermal conductivity of material around the probe attachment device based on a mean time to rise to a specified temperature gain over ambient as measured using the plurality of temperature sensors,
wherein the probe attachment device is configured to removably couple to a cone penetration head configured to obtain cone penetration testing (CPT) data.
8 . A device, the device comprising:
a cone penetration head including one of more sensors;
at least one heating element;
a plurality of temperature sensors, the plurality of temperature sensors being thermally insulated within the device from the at least one heating element; and
at least one processor configured to determine thermal conductivity of material around the probe based on a mean time to return to ambient temperature from a gain over the ambient temperature as measured using the plurality of temperature sensors.
9 . The probe of claim 1 , wherein the at least one processor is further configured to geolocate the CPT data with thermal conductivity data.
10 . The probe of claim 1 , wherein the at least one processor is further configured to establish a 3D model of the CPT data and thermal conductivity data correlated to a particular GPS position within a subsurface.
11 . The probe of claim 1 , wherein the at least one heating element comprises:
at least one heating disk segment.
12 . The probe of claim 1 , further comprising:
one or more spacers usable to position the plurality of temperature sensors at different positions along a length of the probe.
13 . The probe of claim 1 , wherein the at least one processor is physically integrated into the probe.
14 . The probe of claim 1 , wherein the at least one processor is physically separate from the probe and linked via a wired connection.
15 . The probe of claim 1 , wherein the at least one processor is physically separate from the probe and linked via a wireless connection.
16 . The probe of claim 1 , wherein the at least one processor is configured perform the following operations to determine thermal conductivity of material around the probe:
measure ambient temperature using at least one of the plurality of temperature sensors;
energize the at least one heating element;
measure temperature using the plurality of temperature sensors to determine the mean time to rise to the specified gain over the ambient temperature; and
determine thermal conductivity based on the mean time to rise.
17 . The device of claim 8 , wherein the at least one processor is physically integrated into the device.
18 . The device of claim 8 , wherein the at least one processor is physically separate from the device and linked via a wired connection.
19 . The device of claim 8 , wherein the at least one processor is physically separate from the device and linked via a wireless connection.
20 . The device of claim 8 , wherein the at least one processor is further configured to:
energize the at least one heating element;
measure temperature using the plurality of temperature sensors to determine a mean time to rise to the gain over the ambient temperature; and
determine thermal conductivity based on the mean time to rise.
21 . The device of claim 8 , wherein the at least one processor is configured to perform the following operations to determine thermal conductivity of material around the probe:
energize the at least one heating element to emit heat;
de-energize the at least one heating element to stop emitting heat in response to detecting the gain over the ambient temperature;
measure temperature using the plurality of temperature sensors to obtain a set of times to return to the ambient temperature; and
determine thermal conductivity based on the mean of the set of times to return to the ambient temperature.