IP Library › Granted Patent US 12,545,193
Granted Patent B2
US 12,545,193 · App. 18/636,835 · Granted Feb 10, 2026

Vehicle-mounted camera

Inventor: Toshihiro Tokito (Kanagawa, JP)
Assignee: Sony Semiconductor Solutions Corporation
B60R11/04H04N23/57H05K1/118B60R2300/10B60R2300/30H05K2201/10151
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Quick Facts
Patent No.
US 12,545,193
App. No.
18/636,835
Granted
Feb 10, 2026
Kind
B2
Abstract

A vehicle-mounted camera, comprising: an imaging device board including a first terminal; a main board including a second terminal; and a flexible board including a first connection portion to be connected to the first terminal, a second connection portion to be connected to the second terminal, and a first bending portion and a second bending portion that are located between the first connection portion and the second connection portion and are bent along a first bending axis and a second bending axis intersecting with each other in a developed state of the flexible board.

Claims (17)

1 . A vehicle-mounted camera, comprising:

an imaging device board including a first terminal;

a main board including a second terminal; and

a flexible board including

a first connection portion to be connected to the first terminal,

a second connection portion to be connected to the second terminal, and a first bending portion and a second bending portion that are located between the first connection portion and the second connection portion and are bent along a first bending axis and a second bending axis intersecting with each other in a developed state of the flexible board, wherein

the imaging device board further includes a crystal oscillator, and

the flexible board does not pass near the crystal oscillator.

2 . The vehicle-mounted camera according to claim 1 , wherein

the flexible board further includes

a first extension portion including the first bending portion, and

a second extension portion including the second bending portion, and in the developed state of the flexible board, the first extension portion extends in a direction orthogonal to the first bending axis, and the second extension portion extends in a direction orthogonal to the second bending axis.

3 . The vehicle-mounted camera according to claim 1 , wherein

the first bending axis and the second bending axis are orthogonal to each other in the developed state of the flexible board.

4 . The vehicle-mounted camera according to claim 1 , further comprising

an optical unit having an optical axis extending in a thickness direction of the imaging device board.

5 . The vehicle-mounted camera according to claim 1 , wherein the imaging device board is tilted at an acute angle with respect to the main board.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2024
From: TOKITO, TOSHIHIRO
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 067825/0438 →
Priority Claims (1)
JP 2018-214503 · Nov 15, 2018 · national
Continuity (2)
Continuation 17289189
Related Publication 20240270179A1 · Aug 15, 2024
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