Semiconductor structure including sectioned well region
Disclosed is a semiconductor structure including a substrate with a first type conductivity (e.g., a P-silicon substrate); a deep well region within the substrate and having a second type conductivity (e.g., a deep Nwell); alternating stripes of first and second well regions (e.g., of Pwells and Nwells with each Pwell positioned laterally between and abutting two Nwells) within the substrate above and traversing the deep well region; and an isolation region (e.g., an Nwell-type isolation region) dividing a first well region (e.g., a Pwell) into sections. Since the sectioned first well region has the first type conductivity and since the isolation region, the deep well region below, and the adjacent well regions on either side have the second type conductivity, the different sections of the sectioned well region are electrically isolated and devices formed on an insulator layer above the different sections can be subjected to different back-biasing conditions.
1 . A semiconductor structure comprising:
a semiconductor substrate having a first type conductivity;
a deep well region within the semiconductor substrate and having a second type conductivity that is different from the first type conductivity;
first well regions within the semiconductor substrate above the deep well region and having the first type conductivity;
second well regions within the semiconductor substrate above the deep well region and having the second type conductivity, wherein the first well regions and the second well regions are arranged in alternating elongated parallel stripes across the deep well region with each first well region positioned laterally between and abutting two second well regions;
an isolation region within the semiconductor substrate above the deep well region and dividing a first well region of the first well regions into different sections; and
on each section of the different sections, an additional isolation region positioned laterally between a semiconductor-on-insulator region and a contact area, wherein the contact area is positioned laterally between and immediately adjacent to the additional isolation region and the isolation region.
2 . The semiconductor structure of claim 1 , wherein the different sections are electrically connected to different first voltage sources and wherein the second well regions are all electrically connected to a single second voltage source.
3 . The semiconductor structure of claim 2 , further comprising:
semiconductor-on-insulator regions, wherein, within the semiconductor-on-insulator regions, the semiconductor structure includes insulator layers on the first well regions and the second well regions and semiconductor layers on the insulator layers; and
devices in the semiconductor-on-insulator regions, wherein, due to the isolation region, the different sections are biasable at different voltage levels.
4 . The semiconductor structure of claim 3 , further comprising bulk regions,
wherein the bulk regions comprise at least two different bulk regions traversing interfaces between the different sections and an adjacent second well region,
wherein the different sections are electrically connected to the two different first voltage sources through the two different bulk regions, and
wherein the adjacent second well region is connected to the single second voltage source through the two different bulk regions.
5 . The semiconductor structure of claim 1 , wherein, due to the isolation region, the different sections are biasable at different voltage levels.
6 . The semiconductor structure of claim 1 ,
wherein the isolation region includes a well-type isolation region with the second type conductivity,
wherein the isolation region extends vertically from the deep well region to a top surface of the semiconductor substrate, and
wherein the isolation region is perpendicular to and extends laterally through the first well region from one side to an opposite side.
7 . The semiconductor structure of claim 1 , further comprising multiple isolation regions within the semiconductor substrate, wherein the multiple isolation regions divide one of the first well regions into more than two different sections.
8 . The semiconductor structure of claim 1 , further comprising multiple isolation regions within the semiconductor substrate, wherein the multiple isolation regions divide each of at least two of the first well regions into at least two different sections.
9 . A semiconductor structure comprising:
a semiconductor substrate having a first type conductivity;
a deep well region within the semiconductor substrate and having a second type conductivity;
first well regions within the semiconductor substrate above the deep well region and having the first type conductivity;
second well regions within the semiconductor substrate above the deep well region and having the second type conductivity, wherein the first well regions and the second well regions are arranged in alternating elongated parallel stripes in a first direction across the deep well region with each first well region positioned laterally between and abutting two second well regions;
semiconductor-on-insulator regions and bulk regions above and traversing the first well regions and the second well regions in a second direction perpendicular to the first direction; and
a well-type isolation region within the semiconductor substrate above the deep well region, wherein the well-type isolation region has the second type conductivity and divides a first well region of the first well regions into different sections, and wherein the well-type isolation region extends laterally in the first direction between two different bulk regions and extends laterally in the second direction between two different portions of a semiconductor-on-insulator region.
10 . The semiconductor structure of claim 9 , wherein the different sections are electrically connected to different first voltage sources, respectively, and wherein the second well regions are all electrically connected to a single second voltage source.
11 . The semiconductor structure of claim 10 , wherein the different sections are electrically connected to the two different first voltage sources through the two different bulk regions.
12 . The semiconductor structure of claim 9 , wherein, due to the well-type isolation region, the different sections are biasable at different voltage levels.
13 . The semiconductor structure of claim 9 , further comprising a trench isolation region extending vertically from a top surface of the semiconductor substrate to the well-type isolation region, extending laterally in the first direction between the two different bulk regions, and extending laterally in the second direction between the two different portions of the semiconductor-on-insulator region.
14 . The semiconductor structure of claim 9 , further comprising multiple well-type isolation regions within the semiconductor substrate, wherein the multiple well-type isolation regions have the second type conductivity and divide the first well region into more than two different sections.
15 . The semiconductor structure of claim 9 , further comprising multiple well-type isolation regions within the semiconductor substrate, wherein the multiple well-type isolation regions have the second type conductivity and divide each of at least two of the first well regions into at least two different sections.
16 . The semiconductor structure of claim 9 ,
wherein, within the semiconductor-on-insulator regions, the semiconductor structure comprises insulator layers on the first well regions and the second well regions and semiconductor layers on the insulator layers,
wherein the semiconductor structure further comprises devices in the semiconductor-on-insulator regions, and
wherein, due to the well-type isolation region, the different sections are biasable at different voltage levels.
17 . A semiconductor structure comprising:
a semiconductor substrate with a first type conductivity;
a deep well region within the semiconductor substrate and having a second type conductivity;
first well regions within the semiconductor substrate above the deep well region and having the first type conductivity;
second well regions within the semiconductor substrate above the deep well region and having the second type conductivity, wherein the first well regions and the second well regions are arranged in alternating elongated parallel stripes in a first direction across the deep well region with each first well region positioned laterally between and abutting two second well regions;
semiconductor-on-insulator regions and bulk regions above and traversing the first well regions and the second well regions in a second direction perpendicular to the first direction;
a well-type isolation region within the semiconductor substrate above the deep well region and dividing a first well region of the first well regions into different sections, wherein the well-type isolation region has the second type conductivity, extends laterally in the first direction between two different bulk regions and extends laterally in the second direction between different portions of a semiconductor-on-insulator region; and
field effect transistors in the semiconductor-on-insulator regions, wherein, due to the isolation region, the different sections are biasable at different voltage levels.
18 . The semiconductor structure of claim 17 , wherein the different sections are connected to receive different voltages, respectively.
19 . The semiconductor structure of claim 17 , further comprising a trench isolation region extending vertically from a top surface of the semiconductor substrate to the well-type isolation region, extending laterally in the first direction between the two different bulk regions, and extending laterally in the second direction between the different portions.
20 . The semiconductor structure of claim 17 , wherein the first well regions and the second well regions have approximately equal lengths and approximately aligned ends.