Scalable network-on-chip for high-bandwidth memory
Described herein are memory controllers for integrated circuits that implement network-on-chip (NoC) to provide access to memory to couple processing cores of the integrated circuit to a memory device. The NoC may be dedicated to service the memory controller and may include one or more routers to facilitate management of the access to the memory controller.
1 . An electronic device, comprising:
a high-bandwidth memory (HBM) device; and
an integrated circuit device coupled to the HBM device, the integrated circuit device comprising:
a memory controller communicatively coupled to the HBM device and configurable to receive data from the HBM device;
a memory controller Network-on-Chip (NOC) coupled to the memory controller and configurable to receive the data from the memory controller;
a fabric NOC; and
a plurality of processing cores, wherein a first data processing core of the plurality of processor cores is configurable to access the memory controller through the fabric NOC and a second data processing core of the plurality of processing cores is configurable to access the memory controller through a direct interconnect coupled to a first router of the fabric NOC.
2 . The electronic device of claim 1 , wherein the fabric NOC is coupled to the memory controller NOC and configurable to receive the data from the memory controller NOC to route data and route the data to one or more processing cores of a plurality of processing cores of the integrated circuit device, wherein a first router of the memory controller NOC is configurable to route data to a second router of the fabric NOC.
3 . The electronic device of claim 1 , wherein a first router of the memory controller NOC comprises a first port configurable to exchange the data and a second port configurable to exchange the data with the HBM device.
4 . The electronic device of claim 1 , wherein the integrated circuit device comprises a bridge configurable to couple the integrated circuit device to the HBM device.
5 . The electronic device of claim 4 , wherein the bridge comprises a plurality of data links configurable to couple a memory interface of the memory controller to a memory channel of the HBM device.
6 . The electronic device of claim 5 , wherein the memory interface is configurable to operate in accordance with an Advanced Extensible Interface 4 (AXI4) protocol, an AXI3 protocol, an AXI-Lite protocol, an AXI Coherency Extensions (ACE) protocol, an Avalon Interface protocol, or a combination thereof.
7 . The electronic device of claim 1 , wherein the first data processing core comprises digital signal processing (DSP) circuitry, a reduced instruction set computer (RISC) processor core, an advanced RISC machine (ARM) processor core, or a combination thereof.
8 . The electronic device of claim 1 , wherein the memory controller NOC comprises a first router comprising a set of ports and crossbar circuitry configurable to link ports of the set of ports.
9 . The electronic device of claim 8 , wherein the first router is configurable to route data to a second router of the fabric NOC.
10 . The electronic device of claim 1 , wherein the second data processing core is configurable to provide data packets in a NoC protocol via the direct interconnect.
11 . An integrated circuit device, comprising:
a plurality of processing cores;
a memory controller communicatively coupled to a high bandwidth memory (HBM) device and configured to receive data from the HBM device;
a first memory controller Network-on-Chip (NOC) configurable to communicatively couple the integrated circuit device to the HBM device, wherein the first memory controller NOC comprises a first plurality of routers in a horizontal configuration; and
a second fabric NOC coupled to the plurality of processing cores and comprising a second plurality of routers in a vertical configuration, wherein the second fabric NOC is configurable to:
receive data from a first router of the first memory controller NOC through a second router of the second fabric NOC; and
transfer the data to a processing core of the plurality of processing cores,
wherein a first data processing core of the plurality of processing cores is to access the memory controller through the second fabric NOC, and
wherein a second data processing core of the plurality of processing cores is to access the memory controller through a direct interconnect coupled to a third router of the fabric second NOC.
12 . The integrated circuit device of claim 11 , wherein the first router comprises a set of ports and crossbar circuitry configurable to link ports of the set of ports.
13 . The integrated circuit device of claim 11 , wherein the memory controller comprises hardened circuitry.
14 . The integrated circuit device of claim 11 , wherein the plurality of processing cores comprises a digital processor core, a reduced instruction set computer (RISC) processor core, an advanced RISC machine (ARM) processor core, or a combination thereof.
15 . An electronic device comprising:
a high-bandwidth memory (HBM) device; and
an integrated circuit device coupled to the HBM device, the integrated circuit device comprising:
a plurality of data processing cores;
a memory controller communicatively coupled to the HBM device and configured to receive data from the HBM device;
a first Network-on-Chip (NOC) configurable to communicatively couple the integrated circuit device to the HBM device; and
a second NOC coupled to the first NOC and configurable to receive a data packet from the first NOC and route the data packet to one or more of the plurality of data processing cores, wherein a first router of the second NOC is configurable to receive the data packet from a second router of the first NOC and transfer the data to a third router of the second NOC based on a destination address of the data packet.
16 . The electronic device of claim 15 , wherein the plurality of data processing cores comprises a digital processing core, a reduced instruction set computer (RISC) processor core, an advanced RISC machine (ARM) processor core, or a combination thereof.
17 . The electronic device of claim 15 , wherein the memory controller comprises crossbar circuitry, and wherein the memory controller is configurable to block the crossbar circuitry from transmitting data in a bypass mode.
18 . The electronic device of claim 15 , comprising a bridge coupled to the memory controller, wherein the bridge is configurable to convert the data packet between a NOC protocol and a memory interface protocol.
19 . The electronic device of claim 18 , wherein the memory interface protocol comprises an Advanced Extensible Interface 4 (AXI4) protocol, an AXI3 protocol, an AXI-Lite protocol, an AXI Coherency Extension (ACE) protocol, an Avalon Interface protocol, or a combination thereof.
20 . The electronic device of claim 15 , wherein the memory controller comprises a first clock crossing circuitry configurable to couple the first router of the first NOC to a first data processing core of the plurality of data processing cores, wherein the first data processing core operates in a first clocking domain and the first router operates in a memory controller clock domain.