PCB production by laser systems
Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.
1. A system for fabricating a printed circuit board (PCB) assembly, the system comprising:
a substrate holder configured to hold a PCB substrate and translatable between a plurality of processing stations, said processing stations including a printing station;
the printing station configured for laser-assisted deposition (LAD) of one or more materials by jetting respective ones of said materials individually from respective donor substrates on which said respective ones of said materials are coated or otherwise disposed;
a curing station configured to cure by heating, infrared (IR) irradiation, or ultraviolet (UV) irradiation, deposited ones of said materials on said PCB substrate; and
a drilling station configured to drill or engrave through holes and/or vias in said PCB substrate and/or layers of ones of said materials disposed thereon,
wherein the donor substrate includes a first donor substrate and a second donor substrate, and
wherein the printing station is configured to jet metal droplets from the first donor substrate onto the PCB substrate and/or into one or more holes therein to form a layer of metal on the PCB substrate using a laser of the printing station and to jet a solder mask material from the second donor substrate onto the layer of metal to form a first layer of the solder mask on the layer of metal using the laser of the printing station.
2. The system of claim 1 , wherein said printing station is further configured for laser sintering and/or laser ablation of said respective ones of said materials printed on said PCB substrate and/or additional layers of said PCB assembly.
3. The system of claim 1 , wherein said materials include copper and gold pastes, an epoxy, and the solder mask material.
4. The system of claim 1 , further comprising a unit configured to flip the PCB substrate to allow access to both sides of the PCB substrate by the printing station, curing station, and/or drilling station.
5. The system of claim 1 , wherein the curing station is configured to cure the solder mask material.
6. The system of claim 1 , wherein the solder mask material is jetted from the second donor substrate by focusing the laser of the printing station onto an interface between the second donor substrate and a second layer of solder mask material on the second donor substrate.
7. The system of claim 1 , wherein the drilling station is configured to drill holes in the first solder mask material.
8. A system for fabricating a printed circuit board (PCB) assembly, the system comprising:
a substrate holder configured to hold a PCB substrate and translatable between a plurality of processing stations, said processing stations including a printing station;
the printing station configured for laser-assisted deposition (LAD) of one or more materials by jetting respective ones of said materials individually from respective donor substrates on which said respective ones of said materials are coated or otherwise disposed;
a curing station configured to cure by heating, infrared (IR) irradiation, or ultraviolet (UV) irradiation, deposited ones of said materials on said PCB substrate; and
a drilling station configured to drill or engrave through holes and/or vias in said PCB substrate and/or layers of ones of said materials disposed thereon,
wherein the donor substrate includes a first donor substrate and a second donor substrate, and
wherein the printing station is configured to jet solder mask material from the first donor substrate towards the PCB substrate to form a layer of solder mask material over the PCB substrate using a laser of the printing station and to jet dots of label material from the second donor substrate onto the layer of solder mask material to form a layer of the label material on the layer of solder mask material using the laser of the printing station.
9. The system of claim 8 , wherein said printing station is further configured for laser sintering and/or laser ablation of said respective ones of said materials printed on said PCB substrate and/or additional layers of said PCB assembly.
10. The system of claim 8 , wherein said materials include copper and gold pastes, an epoxy, and the solder mask material.
11. The system of claim 8 , further comprising a unit configured to flip the PCB substrate to allow access to both sides of the PCB substrate by the printing station, curing station, and/or drilling station.
12. The system of claim 8 , wherein the curing station is configured to cure the layer of the label material.
13. The system of claim 12 , wherein the curing station is configured to cure the layer of solder mask material.
14. A system for fabricating a printed circuit board (PCB) assembly, the system comprising:
a substrate holder configured to hold a PCB substrate and translatable between a plurality of processing stations, said processing stations including a printing station;
the printing station configured for laser-assisted deposition (LAD) of one or more materials by jetting respective ones of said materials individually from respective donor substrates on which said respective ones of said materials are coated or otherwise disposed;
a curing station configured to cure by heating, infrared (IR) irradiation, or ultraviolet (UV) irradiation, deposited ones of said materials on said PCB substrate; and
a drilling station configured to drill or engrave through holes and/or vias in said PCB substrate and/or layers of ones of said materials disposed thereon,
wherein the donor substrate includes a first donor substrate and a second donor substrate, and
wherein the printing station is configured to jet an epoxy from the first donor substrate to form a layer of the epoxy over the PCB substrate using a laser of the printing station and to jet a solder mask material from the second donor substrate onto the layer of epoxy to form a first layer of the solder mask on the layer of epoxy using the laser of the printing station.
15. The system of claim 14 , wherein said printing station is further configured for laser sintering and/or laser ablation of said respective ones of said materials printed on said PCB substrate and/or additional layers of said PCB assembly.
16. The system of claim 14 , wherein said materials include copper and gold pastes, the epoxy, and the solder mask material.
17. The system of claim 14 , further comprising a unit configured to flip the PCB substrate to allow access to both sides of the PCB substrate by the printing station, curing station, and/or drilling station.
18. The system of claim 14 , wherein the curing station is configured to cure the solder mask material.
19. The system of claim 14 , wherein the solder mask material is jetted from the second donor substrate by focusing the laser of the printing station onto an interface between the second donor substrate and a second layer of solder mask material on the second donor substrate.
20. The system of claim 14 , wherein the drilling station is configured to drill holes in the first solder mask material.