Double self-aligned metal oxide TFT
A method of fabricating MOTFTs on transparent substrates includes positioning opaque gate metal on the front surface of a transparent substrate and depositing transparent gate dielectric, transparent metal oxide semiconductor material, and passivation material on the gate metal and the surrounding area. Portions of the passivation material are exposed from the rear surface of the substrate. Exposed portions are removed to define a channel area overlying the gate area. A relatively thick conductive metal material is selectively deposited on the exposed areas of the semiconductor material to form thick metal source/drain contacts. The selective deposition includes either plating or printing and processing a metal paste.
1. A method of fabricating metal oxide TFTs on transparent substrates comprising the steps of:
providing a transparent substrate having a front surface and a rear surface;
positioning opaque gate metal on the front surface of the substrate to define a gate area for a TFT;
depositing a layer of transparent gate dielectric on the front surface of the substrate overlying the gate metal and a surrounding area and a layer of transparent metal oxide semiconductor material on the surface of the layer of transparent gate dielectric;
depositing a layer of passivation material on the layer of metal oxide semiconductor material;
exposing portions of the layer of passivation material from the rear surface of the substrate and removing exposed portions of the layer of passivation material to leave a passivation area defining a channel area for the TFT overlying the gate area;
depositing a seed layer of thin conductive material on the layer of metal oxide semiconductor material;
depositing a layer of positive working photo resist material on the seed layer;
exposing portions of the layer of positive working photo resist material from the rear surface of the substrate and removing exposed portions of the layer of positive working photo resist material to leave a portion of the positive working photo resist material overlying the channel area and leaving exposed areas of the seed layer defining source/drain areas for the TFT;
plating a relatively thick layer of conductive metal on the exposed areas of the seed layer; and
using the layer of conductive metal, removing the portion of the positive working photo resist material and the seed layer overlying the channel area.
2. A method as claimed in claim 1 wherein the step of plating the conductive metal includes plating one of Cu, Ni, Cr, and combinations thereof.
3. A method as claimed in claim 2 wherein the step of depositing the passivation layer includes depositing and processing a patternable material as the layer of passivation material.
4. A method as claimed in claim 1 wherein the step of depositing the seed layer of thin transparent conductive material includes depositing one of a transparent conductive metal oxide, a transparent layer of thin metal, and a transparent organic layer.
5. A method as claimed in claim 4 wherein the step of depositing the seed layer includes depositing one of Pt, Pd, and Au.
6. A method as claimed in claim 1 including a step of incorporating the metal oxide TFTs into one of electronic devices and circuits including thin film OLED and LCD circuits, thin film driving circuits, active matrix LED, OLED and LCD displays, imaging array devices and thin film readout devices.
7. A method of fabricating metal oxide TFTs on transparent substrates comprising the steps of:
providing a transparent substrate having a front surface and a rear surface;
positioning opaque gate metal on the front surface of the substrate to define a gate area for a TFT;
depositing a layer of transparent gate dielectric on the front surface of the substrate overlying the gate metal and a surrounding area and a layer of transparent metal oxide semiconductor material on the surface of the layer of transparent gate dielectric;
depositing a layer of passivation material on the layer of metal oxide semiconductor material;
exposing portions of the layer of passivation material from the rear surface of the substrate and removing exposed portions of the layer of passivation material to leave a passivation area defining a channel area for the TFT overlying the gate area and leaving exposed areas of the metal oxide semiconductor material defining source/drain areas for the TFT;
depositing a relatively thick layer of conductive metal material on the exposed areas of the layer of metal oxide semiconductor material; and
processing the layer of conductive metal material to provide thick metal source/drain contacts in communication with the metal oxide semiconductor material in the source/drain areas.
8. A method as claimed in claim 7 wherein the layer of passivation material is positive photoresist.
9. A method as claimed in claim 7 wherein the step of depositing a relatively thick layer of conductive metal material includes printing, dipping, or coating.
10. A method as claimed in claim 9 wherein the step of depositing a relatively thick layer of conductive metal material includes depositing a conductive paste.
11. A method as claimed in claim 10 wherein the step of depositing the layer of conductive paste includes depositing silver paste, carbon black paste, or carbon nanotube paste.
12. A method as claimed in claim 10 wherein the step of processing the layer of conductive metal material includes heating the conductive paste to remove solvents or organic groups.
13. A method as claimed in claim 7 including a step of incorporating the metal oxide TFTs into one of electronic devices and circuits including thin film OLED and LCD circuits, thin film driving circuits, active matrix LED, OLED and LCD displays, imaging array devices and thin film readout devices.
14. A method of fabricating metal oxide TFTs on transparent substrates comprising the steps of:
providing a transparent substrate having a front surface and a rear surface;
positioning opaque gate metal on the front surface of the substrate to define a gate area for a TFT;
depositing a layer of transparent gate dielectric on the front surface of the substrate overlying the gate metal and a surrounding area and a layer of transparent metal oxide semiconductor material on the surface of the layer of transparent gate dielectric overlying the gate metal and the surrounding area;
depositing a layer of passivation material on the layer of metal oxide semiconductor material overlying the gate metal and the surrounding area;
exposing portions of the layer of passivation material from the rear surface of the substrate and removing exposed portions of the layer of passivation material to leave a passivation area defining a channel area for the TFT overlying the gate area and source/drain areas for the TFT on either side of the channel area; and
selectively depositing a relatively thick layer of conductive metal material on the exposed areas of the layer of metal oxide semiconductor material.
15. A method as claimed in claim 14 wherein the step of selectively depositing the relatively thick layer of conductive metal material includes the steps of providing a seed layer of thin conductive material and plating a conductive metal on the seed layer.
16. A method as claimed in claim 14 wherein the step of selectively depositing the relatively thick layer of conductive metal material includes the steps of depositing a metal paste material on the exposed areas of the layer of metal oxide semiconductor material and processing the metal paste material to provide thick metal source/drain contacts in communication with the metal oxide semiconductor material in the source/drain areas.
17. A method as claimed in claim 14 including a step of incorporating the metal oxide TFTs into one of electronic devices and circuits including thin film OLED and LCD circuits, thin film driving circuits, active matrix LED, OLED and LCD displays, imaging array devices and thin film readout devices.
18. A method as claimed in claim 14 wherein the step of exposing portions of the layer of passivation material includes one of laser scanning and shaped light scanning.
19. A method as claimed in claim 18 wherein the step of exposing portions of the layer of passivation material uses laser scanning and includes tuning laser pulse time and duration to align with substrate dimension changes, thereby allowing the use of a thin organic flexible substrate.
20. A method as claimed in claim 14 wherein the steps of exposing portions of the layer of passivation material and selectively depositing a relatively thick layer of conductive metal material include forming buslines and other circuitry in the relatively thick layer of conductive metal material.