Substrate processing method
The present application relates to a substrate processing method of suppressing cracking and chipping of a laminated substrate manufactured by bonding substrates, and more particularly to a technique of applying filler to a gap formed between edge portions of the substrates constituting the laminated substrate. The substrate processing method includes: applying a first filler to the gap between an edge portion of a first substrate and an edge portion of a second substrate; and applying a second filler to the gap between the edge portion of the first substrate and the edge portion of the second substrate after applying of the first filler. A viscosity of the first filler is lower than a viscosity of the second filler.
1 . A substrate processing method of applying a filler to a laminated substrate having a first substrate and a second substrate bonded to each other, comprising:
applying a first filler to a gap between a bevel portion of the bonded first substrate constituting the laminated substrate and a bevel portion of the bonded second substrate constituting the laminated substrate; and
applying a second filler to the gap after applying of the first filler to fill the gap with the first filler and the second filler, a viscosity of the first filler being lower than a viscosity of the second filler.
2 . The substrate processing method according to claim 1 , further comprising curing the first filler after applying of the first filler,
wherein applying of the second filler is performed after curing of the first filler.
3 . The substrate processing method according to claim 1 , wherein the first filler contains particles, and a diameter of each of the particles is 1 μm or less.
4 . The substrate processing method according to claim 3 , wherein the second filler contains particles, and a diameter of each of the particles contained in the second filler is larger than the diameter of each of the particles contained in the first filler.
5 . The substrate processing method according to claim 1 , wherein the first filler does not contain particles.
6 . The substrate processing method according to claim 1 , wherein the viscosity of the first filler is 5 Pa·s or less.
7 . The substrate processing method according to claim 1 , wherein a radial width of the applied first filler is smaller than a radial width of the applied second filler.
8 . A substrate processing method of applying a filler to a laminated substrate having a first substrate and a second substrate bonded to each other, comprising:
applying a first filler to a gap between an edge portion of the bonded first substrate constituting the laminated substrate and an edge portion of the bonded second substrate constituting the laminated substrate;
applying a second filler to the gap after applying of the first filler, a viscosity of the first filler being lower than a viscosity of the second filler;
applying a third filler to the gap after applying of the second filler; and
post-processing for the laminated substrate after applying of the third filler,
wherein the third filler has chemical resistance that does not allow the third filler to be dissolved by a processing liquid for use in the post-processing.
9 . A substrate processing method of applying a filler to a laminated substrate having a first substrate and a second substrate bonded to each other, comprising:
applying a first filler to a gap between an edge portion of the bonded first substrate constituting the laminated substrate and an edge portion of the bonded second substrate constituting the laminated substrate;
applying a second filler to the gap after applying of the first filler, a viscosity of the first filler being lower than a viscosity of the second filler; and
applying a third filler to the gap after applying of the second filler, a viscosity of the third filler being higher than the viscosity of the second filler.
10 . The substrate processing method according to claim 8 , further comprising curing the second filler after applying of the second filler,
wherein applying of the third filler is performed after curing of the second filler.
11 . The substrate processing method according to claim 8 , wherein a radial width of the applied second filler is larger than a radial width of the applied third filler.
12 . A substrate processing method of applying a filler to a laminated substrate having a first substrate and a second substrate bonded to each other, comprising:
applying a first filler to a gap between an edge portion of the bonded first substrate constituting the laminated substrate and an edge portion of the bonded second substrate constituting the laminated substrate;
applying a second filler to the gap after applying of the first filler; and
post-processing for the laminated substrate after applying of the second filler,
wherein the second filler has chemical resistance that does not allow the second filler to be dissolved by a processing liquid for use in the post-processing.
13 . The substrate processing method according to claim 12 , further comprising curing the first filler after applying of the first filler,
wherein applying of the second filler is performed after curing of the first filler.
14 . The substrate processing method according to claim 12 , wherein the first filler contains particles, and a diameter of each of the particles is 1 μm or less.
15 . The substrate processing method according to claim 12 , wherein the first filler does not contain particles.
16 . The substrate processing method according to claim 1 , wherein applying of the first filler and applying of the second filler are performed while the laminated substrate held in a vertical posture is rotated.
17 . The substrate processing method according to claim 8 , wherein applying of the third filler is performed while the laminated substrate held in a vertical posture is rotated.
18 . The substrate processing method according to claim 12 , wherein applying of the first filler and applying of the second filler are performed while the laminated substrate held in a vertical posture is rotated.