Resin-sealing method
A resin-sealing method for resin-sealing an electronic component using a mold-clamping apparatus provided with raising-lowering mechanisms including a first raising-lowering mechanism and a second raising-lowering mechanism includes steps below. A resin-sealed product obtained by resin-sealing is measured to measure a total thickness variation which is a difference between a maximum value and a minimum value of a thickness. A height difference between a first part of a movable platen corresponding to the first raising-lowering mechanism and a second part of the movable platen corresponding to the second raising-lowering mechanism is determined such that the total thickness variation becomes smaller. The first raising-lowering mechanism and the second raising-lowering mechanism are driven such that the first part and the second part form the height difference. Mold clamping is performed in a state maintaining the height difference.
1 . A resin-sealing method, which is a method for resin-sealing an electronic component using a mold-clamping apparatus comprising a plurality of raising-lowering mechanisms including a first raising-lowering mechanism and a second raising-lowering mechanism, the resin-sealing method comprising:
measuring a resin-sealed product obtained by resin-sealing to measure a total thickness variation which is a difference between a maximum value and a minimum value of a thickness;
determining a height difference between a first part of a movable platen corresponding to the first raising-lowering mechanism and a second part of the movable platen corresponding to the second raising-lowering mechanism such that the total thickness variation becomes smaller;
driving the first raising-lowering mechanism and the second raising-lowering mechanism such that the first part and the second part form the height difference; and
performing mold clamping in a state maintaining the height difference.
2 . The resin-sealing method according to claim 1 , wherein
in the determining the height difference,
comparing a first thickness of the resin-sealed product resin-sealed at a position corresponding to the first part with a second thickness of the resin-sealed product resin-sealed at a position corresponding to the second part, in a case where the first thickness is larger than the second thickness by a first difference,
the height difference is determined such that a movement amount of mold clamping increases by the first difference at the first part,
the height difference is determined such that a movement amount of mold clamping decreases by the first difference at the second part, or
the height difference is determined such that a movement amount of mold clamping increases by a portion of the first difference at the first part, and a movement amount of mold clamping decreases by a remainder of the first difference at the second part.
3 . The resin-sealing method according to claim 1 , wherein
the measuring the total thickness variation, the determining the height difference, the driving, and the performing mold clamping in a state maintaining the height difference are repeated until a predetermined condition is satisfied.
4 . The resin-sealing method according to claim 3 , further comprising:
determining the height difference that satisfies the predetermined condition in a state in which a first mold is attached to the mold-clamping apparatus;
storing the height difference satisfying the predetermined condition; and
reading out the stored height difference in a case where the first mold is attached again to the mold-clamping apparatus.
5 . The resin-sealing method according to claim 4 , wherein
the mold-clamping apparatus has an apparatus ID unique to the apparatus, and the first mold has a mold ID unique to the mold, and
in a case where the first mold is attached again to the mold-clamping apparatus, by collating a combination of the apparatus ID and the mold ID, the height difference associated with the combination is read out.
6 . The resin-sealing method according to claim 1 , wherein
the mold-clamping apparatus comprises four raising-lowering mechanisms including the first raising-lowering mechanism and the second raising-lowering mechanism.