Patent Assignment
Reel/Frame 072291/0310
Merger
Recorded: 2025-09-18
Pages: 17
Assignor
APIC YAMADA CORPORATION
Executed: 2025-07-01
Assignee
YAMAHA ROBOTICS CO., LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, JAPAN
Covered Properties
(2)
Mold Clamping Device
Resin-Sealing Method
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.