IP Library Assignment 072291/0310
Patent Assignment
Reel/Frame 072291/0310

Merger

Recorded: 2025-09-18 Pages: 17
Assignor
APIC YAMADA CORPORATION
Executed: 2025-07-01
Assignee
YAMAHA ROBOTICS CO., LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, JAPAN
Covered Properties (2)
Mold Clamping Device
Application: 18/690,738 →
Publication: US 2025/0162204
Resin-Sealing Method
Application: 18/694,995 →
Publication: US 2024/0416561
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 12, 2024
From: FUJISAWA , MASAHIKO
To: APIC YAMADA CORPORATION
Reel/Frame 066722/0106 →
Assignment of Assignor's Interest Mar 26, 2024
From: FUJISAWA , MASAHIKO; ASAHI, SHINICHI
To: APIC YAMADA CORPORATION
Reel/Frame 066893/0535 →