IP Library Granted Patent US 12,485,586
Granted Patent B2
US 12,485,586 · App. 18/690,738 · Granted Dec 2, 2025

Mold clamping device

Inventor: Masahiko Fujisawa (Nagano, JP)
Assignee: Yamaha Robotics Co., Ltd.
B29C33/22B29C33/20
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Quick Facts
Patent No.
US 12,485,586
App. No.
18/690,738
Granted
Dec 2, 2025
Kind
B2
Abstract

A mold clamping device is provided with a movable platen that moves along a tie bar; a driving mechanism having multiple raising-lowering mechanisms, including a first raising-lowering mechanism and a second raising-lowering mechanism, and configured to be capable of introducing a difference so that a first portion of the movable platen corresponding to the first raising-lowering mechanism is set at a higher position or a lower position than a second portion of the movable platen corresponding to the second raising-lowering mechanism, the driving mechanism moving the movable platen; and a connecting structure, connecting the driving mechanism to the movable platen. The connecting structure is configured as a stopper that restricts movement of the movable platen so that the difference does not become greater than a prescribed value.

Claims (10)

1 . A mold clamping device, comprising:

a movable platen that moves along a tie bar;

a driving mechanism having a plurality of raising-lowering mechanisms, including a first raising-lowering mechanism and a second raising-lowering mechanism, and configured to be capable of introducing a difference so that a first portion of the movable platen corresponding to the first raising-lowering mechanism is set at a higher position or a lower position than a second portion of the movable platen corresponding to the second raising-lowering mechanism, the driving mechanism moving the movable platen; and

a connecting structure, connecting the driving mechanism to the movable platen,

wherein the connecting structure is configured as a stopper that restricts movement of the movable platen so that the difference does not become greater than a prescribed value,

the connecting structure comprises a plurality of connecting tools attached to the first raising-lowering mechanism, and

each of the plurality of connecting tools configures a free shank structure having a movable region of the prescribed value.

2 . The mold clamping device according to claim 1 , wherein the movable platen is configured to be able to smoothly slide on a surface of the tie bar in a state in which the difference is equal to the prescribed value.

3 . The mold clamping device according to claim 2 , wherein the driving mechanism comprises four of the raising-lowering mechanisms.

4 . The mold clamping device according to claim 1 , wherein the driving mechanism comprises four of the raising-lowering mechanisms.

Assignments (2)
MERGER Recorded Sep 18, 2025
From: APIC YAMADA CORPORATION
To: YAMAHA ROBOTICS CO., LTD.
Reel/Frame 072291/0310 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 12, 2024
From: FUJISAWA , MASAHIKO
To: APIC YAMADA CORPORATION
Reel/Frame 066722/0106 →
Continuity (1)
Related Publication 20250162204A1 · May 22, 2025
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