IP Library Assignment 066722/0106
Patent Assignment
Reel/Frame 066722/0106

Assignment of Assignor's Interest

Recorded: 2024-03-12 Pages: 4
Assignor
FUJISAWA , MASAHIKO
Executed: 2024-01-15
Assignee
APIC YAMADA CORPORATION
90, OOAZA KAMITOKUMA, CHIKUMA-SHI, NAGANO, 389-0898, JAPAN
Covered Property (1)
Mold Clamping Device
Application: 18/690,738 →
Publication: US 2025/0162204
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Sep 18, 2025
From: APIC YAMADA CORPORATION
To: YAMAHA ROBOTICS CO., LTD.
Reel/Frame 072291/0310 →