SEMICONDUCTOR DEVICE INCLUDING EMBEDDED SEMICONDUCTOR DIES
A semiconductor device includes one or more semiconductor dies mounted on a substrate and electrically coupled to the substrate for example using bond wires. In accordance with aspects of the present technology, a film layer may thereafter be applied over the one or more semiconductor dies and bond wires. In one example, the one or more semiconductor dies may include a stack of memory dies. In this example, a controller die or other component may be mounted on top of the film layer. In another example, the one or more semiconductor dies may include a controller die mounted directly to the substrate. In this example, a stack of one or more memory dies may be mounted on top of the film layer.
1 . A semiconductor device, comprising:
a substrate;
a stack of one or more memory dies surface mounted to the substrate;
bond wires electrically coupling the stack of one or more memory dies to each other and the substrate;
a film layer having a first surface positioned against the substrate, and a second surface opposite the first surface, the stack of one or more semiconductor dies and the bond wires being embedded within the film layer; and
a component mounted to the second surface of the film layer.
2 . The semiconductor device of claim 1 , wherein the component is a controller die.
3 . The semiconductor device of claim 2 , wherein the bond wires comprise a first set of bond wires, the semiconductor device further comprising a second set of bond wires electrically coupling the controller die to the substrate.
4 . The semiconductor device of claim 1 , wherein the component is a multiplexer.
5 . The semiconductor device of claim 1 , wherein the component is a spacer layer.
6 . The semiconductor device of claim 1 , further comprising an encapsulant for encapsulating the film layer and component.
7 . The semiconductor device of claim 1 , wherein the film layer is a curable epoxy.
8 . The semiconductor device of claim 7 , wherein the film layer on the substrate is cured from an A-stage to a C-stage.
9 . The semiconductor device of claim 7 , wherein the film layer on the substrate is cured from a B-stage to a C-stage.
10 . The semiconductor device of claim 1 , wherein the film layer is formed on the substrate in a shape and position at least as large as the component.
11 . The semiconductor device of claim 1 , wherein the semiconductor device is a flash memory package.
12 . A semiconductor device, comprising:
a substrate;
a controller die directly mounted to the substrate;
a film layer having a first surface positioned against the substrate, and a second surface opposite the first surface, the controller die being embedded within the film layer;
a stack of one or more memory dies mounted to the second surface of the film layer; and
bond wires electrically coupling the stack of one or more memory dies to each other and the substrate.
13 . The semiconductor device of claim 12 , wherein the bond wires comprise a first set of bond wires, the semiconductor device further comprising a second set of bond wires electrically coupling the controller die to the substrate.
14 . The semiconductor device of claim 12 , wherein the controller die is flip-chip mounted to the substrate.
15 . The semiconductor device of claim 12 , further comprising an encapsulant for encapsulating the film layer and stack of one or more memory dies.
16 . The semiconductor device of claim 12 , wherein the film layer is a curable epoxy.
17 . The semiconductor device of claim 16 , wherein the film layer on the substrate is cured from an A-stage to a C-stage.
18 . The semiconductor device of claim 16 , wherein the film layer on the substrate is cured from a B-stage to a C-stage.
19 . The semiconductor device of claim 12 , further comprising a die attach film attaching a bottommost memory die of the stack of one or more memory dies to the second surface of the film layer.
20 . A semiconductor device, comprising:
a substrate;
a stack of one or more memory dies surface mounted to the substrate;
a first set of bond wires electrically coupling the stack of one or more memory dies to each other and the substrate;
means, applied to the substrate, for embedding the stack of one or more semiconductor dies and the first set of bond wires;
a controller die mounted on the embedding means; and
a second set of bond wires electrically coupling the controller die to the substrate.