IP Library Granted Patent US 12,443,077
Granted Patent B2
US 12,443,077 · App. 18/740,844 · Granted Oct 14, 2025

Display device

Inventors: Tsung-Han Tsai (Miao-Li County, TW); Hsia-Ching Chu (Miao-Li County, TW); Mei-Chun Shih (Miao-Li County, TW)
Assignee: Red Oak Innovations Limited
G02F1/134309G02F1/133345G02F1/13439G02F1/136286G02F1/1368G02F1/133707G02F1/134363G02F1/136227G02F2202/10
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Quick Facts
Patent No.
US 12,443,077
App. No.
18/740,844
Granted
Oct 14, 2025
Kind
B2
Abstract

A semiconductor substrate includes: a substrate; a first conductive line extending along a first direction; a semiconductor layer, wherein the first conductive line includes a first part overlapping with the semiconductor layer and a second part not overlapping with the semiconductor layer, the first part of the first conductive line has a first width along a second direction different from the first direction, the second part of conductive line has a second width along the second direction, and the first width is greater than the second width; and an electrode disposed on the semiconductor layer and including an arc edge outside the first conductive line, wherein the semiconductor layer includes a first part extending along the second direction and overlapping with the arc edge and a second part connecting the first part and overlapping with a side of the first part of the first conductive line.

Claims (14)

1. A semiconductor substrate, comprising:

a substrate;

a first conductive line disposed on the substrate and extending along a first direction;

a semiconductor layer disposed on the substrate, wherein the first conductive line comprises a first part overlapping with the semiconductor layer and a second part connected to the first part and not overlapping with the semiconductor layer, the first part of the first conductive line has a first width along a second direction different from the first direction, the second part of the first conductive line has a second width along the second direction, and the first width is greater than the second width; and

an electrode disposed on the semiconductor layer and comprising an arc edge outside the first conductive line,

wherein the semiconductor layer comprises a first part extending along the second direction and overlapping with the arc edge and a second part connected to the first part of the semiconductor layer and overlapping with a side of the first part of the first conductive line.

2. The semiconductor substrate of claim 1 , wherein the semiconductor layer further comprises a third part connecting to the second part of the semiconductor layer and extending along the second direction.

3. The semiconductor substrate of claim 2 , further comprising another electrode overlapping with the third part of the semiconductor layer.

4. The semiconductor substrate of claim 1 , further comprising a conductive layer disposed on the electrode.

5. The semiconductor substrate of claim 4 , wherein the conductive layer overlaps with the arc edge.

6. The semiconductor substrate of claim 4 , wherein the conductive layer comprises plural slits.

7. The semiconductor substrate of claim 1 , further comprising a second conductive line, wherein the semiconductor layer overlaps the second conductive line.

8. The semiconductor substrate of claim 1 , wherein the second direction is perpendicular to the first direction.

9. The semiconductor substrate of claim 1 , wherein at least a portion of the electrode and the first conductive line are overlapped.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2024
From: INNOLUX CORPORATION
To: RED OAK INNOVATIONS LIMITED
Reel/Frame 069206/0903 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 12, 2024
From: TSAI, TSUNG-HAN; CHU, HSIA-CHING; SHIH, MEI-CHUN
To: INNOLUX CORPORATION
Reel/Frame 067704/0266 →
Priority Claims (1)
TW 105114848 · May 13, 2016 · national
Continuity (6)
Continuation 18133073 · Apr 11, 2023
Continuation 17944660 · Sep 14, 2022
Continuation 16999350 · Aug 21, 2020
Continuation 16223355 · Dec 18, 2018
Division 15587428 · May 5, 2017
Related Publication 20240329464A1 · Oct 3, 2024
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US 20230244110A1 · Tsai et al. · 2023 [cited by applicant]
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