Chip transferring method and the apparatus thereof
A chip transferring method includes steps of: providing a plurality of chips on a first load-bearing structure; measuring photoelectric characteristic values of the plurality of chips; categorizing the plurality of chips into a first portion of the plurality of chips and a second portion of the plurality of chips according to the photoelectric characteristic values of the plurality of chips, wherein the second portion of the plurality of chips comprise parts of the plurality of chips which photoelectric characteristic value falls within an unqualified range; removing the second portion of the plurality of chips from the first load-bearing structure; dividing the first portion of the plurality of chips into a plurality of blocks, wherein each of the plurality of blocks comprising multiple chips of the first portion of the plurality of chips; and transferring the first portion of the plurality of chips in one of the plurality of blocks to a second load-bearing structure in single-batch.
1 . A chip transferring method, comprising steps of:
providing a plurality of chips on a first load-bearing structure;
measuring photoelectric characteristic values of the plurality of chips;
categorizing the plurality of chips into a first portion of the plurality of chips and a second portion of the plurality of chips according to the photoelectric characteristic values of the plurality of chips, wherein the second portion of the plurality of chips comprises parts of the plurality of chips of which photoelectric characteristic values fall within an unqualified range;
separating the first portion of the plurality of chips and the second portion of the plurality of chips; and
transferring the first portion of the plurality of chips to a second load-bearing structure in single-batch.
2 . The chip transferring method according to claim 1 , further comprising dividing the first portion of the plurality of chips into a plurality of blocks,
wherein each of the plurality of blocks comprises multiple chips of the first portion of the plurality of chips; and
wherein the step of transferring comprises transferring the first portion of the plurality of chips in one of the plurality of blocks to the second load-bearing structure in single-batch.
3 . The chip transferring method according to claim 2 , wherein the step of transferring the first portion of the plurality of chips in the one of the plurality of blocks to the second load-bearing structure in single-batch is performed by a presser.
4 . The chip transferring method according to claim 3 , wherein the pressers comprise a surface, and an area of the surface is larger than or equal to that of the one of the plurality of blocks.
5 . The chip transferring method according to claim 2 , further comprising a step of calculating an average characteristic value of the first portion of the plurality of chips according to the photoelectric characteristic values before the step of transferring.
6 . The chip transferring method according to claim 2 , wherein the step of dividing comprises cutting the first load-bearing structure according to the plurality of blocks.
7 . The chip transferring method according to claim 2 , wherein the plurality of blocks comprises a plurality of virtual blocks.
8 . The chip transferring method according to claim 1 , wherein the step of separating comprises removing the second portion of the plurality of chips from the first load-bearing structure.
9 . The chip transferring method according to claim 8 , wherein the step of removing comprises weakening a first adhesion between the second portion of the plurality of chips and the first load-bearing structure.
10 . The chip transferring method according to claim 9 , wherein the step of weakening the first adhesion comprises a peptization process.
11 . The chip transferring method according to claim 10 , wherein the peptization process comprises illuminating the first load-bearing structure with light.
12 . The chip transferring method according to claim 1 , further comprising a step of forming a peptizer on surfaces of the first portion of the plurality of chips or the second portion of the plurality of chips.
13 . The chip transferring method according to claim 1 , wherein the photoelectric characteristic value comprises a luminescence, a light-emitting wavelength, an operating voltage or an electric current.
14 . The chip transferring method according to claim 1 , further comprising a step of:
recording the photoelectric characteristic values of the plurality of chips to form a wafer map file based on a position of each of the plurality of chips on the first load-bearing structure.
15 . The chip transferring method according to claim 1 , wherein the second load-bearing structure comprises an adhesive surface.
16 . The chip transferring method according to claim 1 , wherein the step of separating comprises transferring the first portion of the plurality of chips to a third load-bearing structure.
17 . The chip transferring method according to claim 16 , further comprising dividing the first portion of the plurality of chips into the plurality of blocks on the third load-bearing structure.