Apparatus, system and method for providing an end effector
The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.
1 . An end effector capable of accommodating semiconductor wafers of varying sizes, comprising:
a wafer support;
a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof;
a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and
a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer for the physical interfacing of the semiconductor wafer with the plurality of support pads.
2 . The end effector of claim 1 , wherein the wafer support comprises a fork.
3 . The end effector of claim 1 , wherein the varying sizes comprise 200 mm and 300 mm.
4 . The end effector of claim 1 , wherein the bi-directional drive comprises at least a moving clamp motor.
5 . The end effector of claim 4 , further comprising a low friction vacuum cylinder engaged for the moving clamp motor.
6 . An end effector capable of accommodating semiconductor wafers of varying sizes, comprising:
a wafer support;
a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof;
a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers;
a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer for the physical interfacing of the semiconductor wafer with the plurality of support pads; and
a low friction vacuum cylinder engaged with the bi-directional drive of the moving clamp,
wherein the vacuum cylinder comprises a seal-less glass tube with a graphite piston.
7 . The end effector of claim 6 , further comprising at least one retract stop that stops retraction of the low friction moving clamp after actuation of the low friction moving clamp by the bi-directional drive.
8 . The end effector of claim 7 , wherein the at least one retract stop is vacuum operated.
9 . The end effector of claim 7 , wherein the at least one retract stop comprises a button stop.
10 . The end effector of claim 4 , further comprising at least one travel stop that stops travel of the low friction moving clamp upon actuation by the bi-directional drive.
11 . The end effector of claim 1 , wherein the low friction moving clamp comprises a rectangular strike face to apply the force.
12 . The end effector of claim 1 , wherein the low friction moving clamp comprises an angular strike face to apply the force.
13 . The end effector of claim 12 , wherein the angular strike face pivots about a substantially center pivot point.
14 . The end effector of claim 13 , wherein the low friction moving clamp further comprises two canted rollers capable of substantially imparting the strike force.
15 . An end effector capable of accommodating semiconductor wafers of varying sizes, comprising:
a wafer support;
a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof;
at least four support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and
a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm,
wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer for the physical interfacing of the semiconductor wafer with the plurality of support pads,
wherein at least two of the support pads are proximal to the bearing arm, and
wherein at least two others of the support pads are distal to the bearing arm.
16 . The end effector of claim 15 , wherein the at least two distal support pads each comprise a ramped portion and a roller portion having a center axis canted in relation to a center axis of the semiconductor wafer.
17 . The end effector of claim 15 , wherein the at least two proximal support pads comprise a ramped portion.
18 . The end effector of claim 15 , wherein at least the proximal support pads or the distal support pads comprise a raised ridge portion.
19 . The end effector of claim 1 , wherein the wafer support further comprises at least one vacuum eyelet for gripping the semiconductor wafer.
20 . The end effector of claim 1 , wherein the wafer support further comprises a fiber optic wafer presence sensor.