Semiconductor-on-insulator (SOI) substrate and method for forming
Various embodiments of the present application are directed towards a semiconductor-on-insulator (SOI) substrate. The SOI substrate includes a handle substrate; a device layer overlying the handle substrate; and an insulator layer separating the handle substrate from the device layer. The insulator layer meets the device layer at a first interface and meets the handle substrate at a second interface. The insulator layer comprises a getter material having a getter concentration profile. The handle substrate contains getter material and has a handle getter concentration profile. The handle getter concentration profile has a peak at the second interface and a gradual decline beneath the second interface until reaching a handle getter concentration.
1 . An integrated circuit, comprising:
a semiconductor base;
a dielectric layer disposed over the semiconductor base;
a semiconductor device layer overlying the dielectric layer,
wherein the dielectric layer comprises a first halogen concentration profile including a first minimum concentration within the dielectric layer, and wherein the semiconductor base has a second halogen concentration profile including a second minimum concentration within the semiconductor base, the second minimum concentration being less than the first minimum concentration; and
wherein the second halogen concentration profile comprises a uniformly doped region between a pair of interfacial regions.
2 . The integrated circuit of claim 1 :
wherein the semiconductor device layer is disposed over an upper surface of the semiconductor base; and
wherein the dielectric layer covers the upper surface of the semiconductor base to separate the upper surface of the semiconductor base from the semiconductor device layer, and covers a lower surface of the semiconductor device layer.
3 . The integrated circuit of claim 2 , wherein the first halogen concentration profile exhibits a first peak concentration at a first interface where the dielectric layer meets the semiconductor base.
4 . The integrated circuit of claim 3 , wherein the first halogen concentration profile exhibits a second peak concentration at a second interface where the dielectric layer meets the semiconductor device layer.
5 . The integrated circuit of claim 4 , wherein the first peak concentration differs from the second peak concentration.
6 . The integrated circuit of claim 4 , wherein the first peak concentration is equal to the second peak concentration.
7 . The integrated circuit of claim 4 , wherein the first peak concentration and the second peak concentration are each at least 1×10 ∧ 18 atoms/cm 3 of chlorine or fluorine, and the first minimum concentration ranges between 1×10 ∧ 14 atoms/cm 3 and 2×10 ∧ 17 atoms/cm 3 .
8 . The integrated circuit of claim 4 , wherein the dielectric layer is confined between the semiconductor device layer and the semiconductor base, such that a lowermost surface of the dielectric layer corresponds to an uppermost surface of the semiconductor base, and an uppermost surface of the dielectric layer corresponds to a lowermost surface of the semiconductor device layer.
9 . The integrated circuit of claim 1 , wherein the first halogen concentration profile and/or the second halogen concentration profile comprises chlorine or fluorine.
10 . An integrated circuit, comprising:
a semiconductor body;
an oxide layer disposed over the semiconductor body;
a monocrystalline silicon layer disposed over the oxide layer;
an interconnect structure disposed over the monocrystalline silicon layer,
wherein the oxide layer separates the semiconductor body from the monocrystalline silicon layer, and wherein the oxide layer comprises a halogen species embedded in oxide material of the oxide layer; and
wherein the halogen species is defined by a concentration profile containing a first peak nearest to the interconnect structure and a second peak nearest to the semiconductor body that is greater than the first peak.
11 . The integrated circuit of claim 10 , wherein the halogen species comprises chlorine or fluorine and the oxide layer comprises silicon dioxide.
12 . The integrated circuit of claim 10 , wherein the halogen species has a concentration ranging between 1×10 14 atoms/cm 3 and 1×10 20 atoms/cm 3 .
13 . The integrated circuit of claim 10 , further comprising:
a plurality of semiconductor devices disposed in the monocrystalline silicon layer; and
wherein the interconnect structure operably couples two or more of the plurality of semiconductor devices to one another.
14 . The integrated circuit of claim 10 , wherein the monocrystalline silicon layer is disposed along a first upper surface of the oxide layer that is offset inwardly from a second upper surface of the oxide layer that is below the first upper surface.
15 . An integrated circuit comprising:
a semiconductor base;
a semiconductor oxide layer disposed over and in direct contact with an upper surface of the semiconductor base; and
a semiconductor device layer disposed over and in direct contact with an upper surface of the semiconductor oxide layer,
wherein the semiconductor oxide layer includes an upper region nearest the semiconductor device layer and a lower region nearest the semiconductor base, the upper region having a first getter doping profile and the lower region having a second getter doping profile that differs from the first getter doping profile; and
wherein the semiconductor base includes a first circumferential outer edge and the semiconductor device layer includes a second circumferential outer edge that is concentric with regard to the first circumferential outer edge and bounded by the first circumferential outer edge when viewed from above.
16 . The integrated circuit of claim 15 , wherein the first getter doping profile and the second getter doping profile meet at an inflection point.
17 . The integrated circuit of claim 15 , further comprising:
a plurality of semiconductor devices disposed in the semiconductor device layer; and
an interconnect structure comprising vias and metal wires disposed over the semiconductor device layer, wherein the interconnect structure operably couples two or more of the plurality of semiconductor devices to one another.
18 . The integrated circuit of claim 15 , wherein the semiconductor oxide layer includes a peripheral region and a central region that are both disposed over the semiconductor base, wherein the peripheral region has a peripheral region thickness as measured perpendicular to an upper surface of the semiconductor base and the central region has a central region thickness as measured perpendicular to the upper surface of the semiconductor base, the central region thickness being greater than the peripheral region thickness.
19 . The integrated circuit of claim 18 , wherein the second circumferential outer edge of the semiconductor device layer corresponds to a sidewall step in the semiconductor oxide layer where the peripheral region meets the central region.
20 . The integrated circuit of claim 15 , wherein the semiconductor oxide layer includes a third circumferential outer edge between the first and second circumferential outer edges.