IP Library Granted Patent US 12,466,979
Granted Patent B2
US 12,466,979 · App. 18/762,402 · Granted Nov 11, 2025

CMP composition including anionic and cationic inhibitors

Inventors: Hsin-Yen Wu (Kaohsiung, TW); Jin-Hao Jhang (Taichung, TW); Cheng-Yuan Ko (Kaohsiung, TW)
Assignee: CMC Materials LLC
C09G1/02C09K3/1409C09K13/00H01L21/3212H01L21/7684
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Quick Facts
Patent No.
US 12,466,979
App. No.
18/762,402
Granted
Nov 11, 2025
Kind
B2
Abstract

A chemical mechanical polishing composition for polishing tungsten or molybdenum comprises, consists essentially of, or consists of a water based liquid carrier, abrasive particles dispersed in the liquid carrier, an amino acid selected from the group consisting of arginine, histidine, cysteine, lysine, and mixtures thereof, an anionic polymer or an anionic surfactant, and an optional amino acid surfactant. A method for chemical mechanical polishing a substrate including a tungsten layer or a molybdenum layer includes contacting the substrate with the above described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the tungsten layer or the molybdenum layer from the substrate and thereby polish the substrate.

Claims (16)

1 . A method of chemical mechanical polishing a substrate having a tungsten layer or a molybdenum layer, the method comprising:

(a) contacting the substrate with a polishing composition comprising:

(i) a water based liquid carrier;

(ii) abrasive particles dispersed in the liquid carrier;

(iii) an amino acid selected from the group consisting of arginine, histidine, cysteine, lysine, and mixtures thereof; and

(iv) an anionic polymer or an anionic surfactant, wherein the polishing composition further comprises an amino acid surfactant;

(b) moving the polishing composition relative to the substrate; and

(c) abrading the substrate to remove a portion of the tungsten layer or the molybdenum layer from the substrate and thereby polish the substrate.

2 . The method of claim 1 , further comprising:

an iron-containing accelerator;

a stabilizer bound to the iron-containing accelerator.

3 . The method of claim 1 , wherein the anionic polymer or the anionic surfactant comprises an anionic surfactant including an alkyl group and a negative charged sulfate or sulfonate group.

4 . The method of claim 1 , wherein:

the amino acid is selected from the group consisting of arginine, histidine, and mixtures thereof;

the anionic polymer or the anionic surfactant comprises an anionic surfactant including an alkyl group and a negative charged sulfate or sulfonate group; and

the amino acid surfactant comprises an amino acid group selected from the group consisting of glycine, alanine, arginine, histidine, lysine, aspartic acid, and glutamic acid.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2025
From: WU, HSIN-YEN; JHANG, JIN-HAO; KO, CHENG-YUAN
To: CMC MATERIALS, INC.
Reel/Frame 072581/0049 →
CHANGE OF NAME Recorded Oct 15, 2025
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 073105/0858 →
Continuity (4)
Division 17384940 · Jul 26, 2021
Provisional Application 63077036 · Sep 11, 2020
Provisional Application 63057639 · Jul 28, 2020
Related Publication 20240352280A1 · Oct 24, 2024
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