IP Library Granted Patent US 12,745,016
Granted Patent B2
US 12,745,016 · App. 18/899,634 · Granted Sep 22, 2026

Image sensing device including test pattern

Inventor: Gon Ji Lee (Icheon-si, KR)
Assignee: SK HYNIX INC.
H04N25/69H04N25/78H10F39/8037
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Quick Facts
Patent No.
US 12,745,016
App. No.
18/899,634
Granted
Sep 22, 2026
Kind
B2
Abstract

An image sensing device includes a pixel array including pixel units that include first pixel transistors located in different rows of the pixel array; first upper signal lines respectively connected to the first pixel transistors; a first test line commonly connected to the first upper signal lines; a first test pad connected to the first test line and configured to provide a first test signal to the first test line; and a first test transistor connected to the first test line and the first test pad and configured to enable or disable a test operation by selectively providing the first test signal to the first test line. During the test operation, the first test signal may be provided to the first pixel transistors located in different rows of the pixel array through the first test transistor, the first test line, and the first upper signal lines.

Claims (70)

1 . An image sensing device, comprising:

a pixel array including pixel units configured to generate photocharge in response to incident light, the pixel units including a plurality of first pixel transistors located in different rows of the pixel array;

a plurality of first upper signal lines respectively connected to the plurality of first pixel transistors;

a first test line, separated from and commonly connected to, the plurality of first upper signal lines;

vertical vias disposed between the first test line and at least one of the plurality of first upper signal lines, the vertical vias being in contact with both the first test line and the at least one of the plurality of first upper signal lines;

a first test pad connected to the first test line and configured to provide a first test signal to the first test line; and

a first test transistor connected to the first test line and the first test pad and configured to enable or disable a test operation by selectively providing the first test signal to the first test line,

wherein

during the test operation, the first test signal is provided to the plurality of first pixel transistors located in different rows of the pixel array through the first test transistor, the first test line, the vertical vias and the plurality of first upper signal lines in sequence.

2 . The image sensing device according to claim 1 , wherein:

each of the plurality of first pixel transistors is a reset transistor, a selection transistor, a transfer transistor, or a gain conversion transistor.

3 . The image sensing device according to claim 1 , further comprising:

a plurality of first lower signal lines respectively connected to the plurality of first upper signal lines,

wherein

the plurality of first pixel transistors, the plurality of first upper signal lines, the vertical vias and the first test line are disposed in a first substrate included in the pixel array; and

the plurality of first lower signal lines is disposed in a second substrate located below the first substrate.

4 . The image sensing device according to claim 1 , wherein the pixel array further includes:

a plurality of second pixel transistors disposed in different rows from one another.

5 . The image sensing device according to claim 1 , wherein:

the pixel units further include an additional first pixel transistor located in a same row of the pixel array as one of the plurality of first pixel transistors, and

one of the plurality of first upper signal lines is connected to the one of the plurality of first pixel transistors and the additional first pixel transistor.

6 . The image sensing device according to claim 1 , further comprising:

a plurality of first lower signal lines respectively connected to the plurality of first upper signal lines,

wherein a first control signal for controlling a first pixel transistor is provided to a plurality of first pixel transistors located in an arbitrary row of the pixel array through an arbitrary first lower signal line and an arbitrary first upper signal line that is located in the arbitrary row of the pixel array and connected to an arbitrary first lower signal line.

7 . The image sensing device according to claim 1 , wherein:

the first test line is located below the at least one of the plurality of first upper signal lines, and is located in a same substrate as the at least one of the plurality of first upper signal lines.

8 . The image sensing device according to claim 1 , wherein the pixel array includes a first substrate and a second substrate that are disposed to overlap each other.

9 . An image sensing device comprising,

a pixel array including pixel units configured to generate photocharge in response to incident light, the pixel units including a plurality of first pixel transistors located in different rows of the pixel array;

a plurality of first upper signal lines respectively connected to the plurality of first pixel transistors;

a first test line, separated from and commonly connected to, the plurality of first upper signal lines;

a first test pad connected to the first test line and configured to provide a first test signal to the first test line; and

a first test transistor connected to the first test line and the first test pad and configured to enable or disable a test operation by selectively providing the first test signal to the first test line,

wherein during the test operation, the first test signal is provided to the plurality of first pixel transistors located in different rows of the pixel array through the first test transistor, the first test line, and the plurality of first upper signal lines,

wherein the pixel array further includes:

a plurality of second upper signal lines respectively connected to a plurality of second pixel transistors;

a second test line separate from and commonly connected to, the plurality of second upper signal lines;

a second test pad connected to the second test line and configured to provide a second test signal to the second test line; and

a second test transistor connected to the second test line and the second test pad.

10 . The image sensing device according to claim 9 , wherein:

the first test transistor and the second test transistor are activated at a same time.

11 . The image sensing device according to claim 9 , wherein:

the first test transistor and the second test transistor are activated at different times from each other.

12 . The image sensing device according to claim 9 , wherein:

each of the plurality of first pixel transistors is a reset transistor, a selection transistor, a transfer transistor, or a gain conversion transistor,

each of the plurality of second pixel transistors is a reset transistor, a selection transistor, a transfer transistor, or a gain conversion transistor, and

the each of the plurality of first pixel transistors is different from the each of the plurality of second pixel transistors.

13 . An image sensing device, comprising:

a pixel array located in a first substrate layer and configured to receive incident light and generate photocharge in response to the incident light;

a plurality of first pixel transistors located in an arbitrary row included in the pixel array;

a first upper signal line connected to the plurality of first pixel transistors and located in the first substrate layer;

a first test line connected to the first upper signal line and located in the first substrate layer;

a first lower signal line connected to the first upper signal line and located in a second substrate layer below the first substrate layer; and

a first test transistor connected to the first lower signal line and a first test pad,

wherein the first test line, the first test transistor and the first test pad are provided to test the plurality of first pixel transistors, and

wherein

during a sensing operation, a first control signal for the first pixel transistor is provided to the plurality of first pixel transistors through the first lower signal line and the first upper signal line, and

during a test operation, a first test signal provided through the first test pad is provided to the plurality of first pixel transistors without passing through the first lower signal line.

14 . The image sensing device according to claim 13 , further comprising:

an additional first pixel transistor located in a different row from the arbitrary row and connected to a different first upper signal line from the first upper signal line.

15 . The image sensing device according to claim 14 , wherein:

the different first upper signal line is connected to the first test line and the first test signal is provided to the additional first pixel transistor.

16 . The image sensing device according to claim 14 , wherein a second control signal different from the first control signal is provided to the additional first pixel transistor.

17 . The image sensing device according to claim 13 , wherein:

each of the plurality of first pixel transistors is a reset transistor, a selection transistor, a transfer transistor, or a gain conversion transistor.

18 . The image sensing device according to claim 13 , wherein:

the first test line is located below the first upper signal line, and is located in a same substrate as the first upper signal line.

19 . The image sensing device according to claim 13 , further comprising:

a second pixel transistor located in the arbitrary row and connected to a different first upper signal line from the first upper signal line.

20 . The image sensing device according to claim 19 , wherein a second test signal different from the first test signal is provided to the second pixel transistor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 27, 2024
From: LEE, GON JI
To: SK HYNIX INC.
Reel/Frame 068725/0455 →
Priority Claims (1)
KR 10-2023-0133368 · Oct 6, 2023 · national
Continuity (1)
Related Publication 20250119661A1 · Apr 10, 2025
References Cited (26)
US 8988575B2 · Mabuchi · 2015 [cited by examiner]
US 9865641B2 · Takemoto · 2018 [cited by examiner]
US 10032822B2 · Takahashi · 2018 [cited by examiner]
US 11257407B2 · Pappas · 2022 [cited by examiner]
US 11735617B2 · Chen · 2023 [cited by examiner]
US 11832011B2 · Asakura · 2023 [cited by examiner]
US 12289965B2 · Zhao · 2025 [cited by examiner]
US 12329001B2 · Jin · 2025 [cited by examiner]
US 20070146002A1 · Hsieh · 2007 [cited by examiner]
US 20090140127A1 · Lee et al. · 2009 [cited by applicant]
US 20120249458A1 · Okazaki · 2012 [cited by examiner]
US 20140104471A1 · Mabuchi et al. · 2014 [cited by applicant]
US 20160141328A1 · Takemoto · 2016 [cited by applicant]
US 20170033144A1 · Takahashi · 2017 [cited by applicant]
US 20200052033A1 · Iguchi · 2020 [cited by examiner]
US 20210242252A1 · Chen et al. · 2021 [cited by applicant]
US 20220046201A1 · Asakura · 2022 [cited by applicant]
US 20220328598A1 · Zhao · 2022 [cited by examiner]
US 20230207575A1 · Yoo · 2023 [cited by examiner]
US 20230215771A1 · Liao et al. · 2023 [cited by applicant]
US 20230316966A1 · Cha · 2023 [cited by examiner]
US 20240407207A1 · Jin · 2024 [cited by examiner]
CN 113937117A · 2022 [cited by applicant]
KR 20030043259A · 2003 [cited by applicant]
Office Action for Taiwanese Appl. No. 113137696, mailed on Jul. 11, 2025, 9 pages with English translation. [cited by applicant]
Extended European Search Report for EP Appl. No. 24204798.3, mailed on Jan. 29, 2025, 11 pages. [cited by applicant]