INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME

1 . (canceled)

2 . A device package comprising:

an integrated cooling assembly comprising a semiconductor device and a cold plate directly bonded to the semiconductor device by direct dielectric bonds, wherein:

the cold plate comprises a top portion and a bottom portion vertically adjacent to the top portion;

the top portion comprises upper cavity dividers extending downwardly to define upper cavity volumes;

the bottom portion comprises lower cavity dividers extending upwardly to define lower cavity volumes; and

the upper cavity dividers and the lower cavity dividers are disposed across a horizontal length of the cold plate with a lateral spacing between adjacent upper and lower cavity dividers.

3 . The device package of claim 2 , wherein:

the upper cavity dividers are spaced horizontally across the top portion at a first lateral spacing and the lower cavity dividers are spaced horizontally across the bottom portion at a second lateral spacing different to the first lateral spacing; and

the lateral spacings between the cavity dividers are greater than a horizontal width of the cavity dividers.

4 . The device package of claim 2 , wherein:

the top portion comprises an upper surface attached to an upper sidewall, the upper sidewall extending downwardly from the upper surface.

5 . The device package of claim 4 , wherein the upper cavity dividers extend downwardly from the upper surface to substantially a same depth as a depth of the upper sidewall.

6 . The device package of claim 4 , wherein the upper cavity dividers extend between opposite sides of the upper sidewall to define the upper cavity volumes.

7 . The device package of claim 2 , wherein:

the bottom portion comprises a lower surface attached to a lower sidewall, the lower sidewall extending upwardly from the lower surface; and

the lower surface is attached to a backside of the semiconductor device.

8 . The device package of claim 7 , wherein the lower cavity dividers extend upwardly from the lower surface to substantially a same depth as a depth of the lower sidewall.

9 . The device package of claim 2 , wherein:

the bottom portion comprises a lower sidewall extending upwardly from a backside of the semiconductor device; and

the lower cavity dividers are disposed on the backside of the semiconductor device.

10 . The device package of claim 9 , wherein the lower cavity dividers extend upwardly from the backside of the semiconductor device to substantially a same depth as a depth of the lower sidewall.

11 . The device package of claim 7 , wherein the lower cavity dividers extend between opposite sides of the lower sidewall to define the lower cavity volumes.

12 . The device package of claim 2 , wherein:

the top portion comprises an upper cavity separator attached between a pair of upper cavity dividers to define compartments within the upper cavity volumes, and

the bottom portion comprises a lower cavity separator attached between a pair of lower cavity dividers to define compartments within the lower cavity volumes.

13 . The device package of claim 2 , wherein surfaces of the upper cavity dividers slope towards the bottom portion at an angle greater than 90 degrees.

14 . The device package of claim 2 , wherein:

surfaces of the lower cavity dividers slope towards the top portion at an angle greater than 90 degrees; or

surfaces of the lower cavity dividers slope towards the top portion at an angle less than 90 degrees.

15 . The device package of claim 2 , wherein the upper cavity dividers are rows of first metal posts and the lower cavity dividers are rows of second metal posts.

16 . The device package of claim 2 , wherein the top portion of the cold plate comprises:

a package cover, the package cover having an inlet opening and an outlet opening disposed therethrough, and wherein:

the upper cavity volumes and the lower cavity volumes collectively define a coolant chamber volume therebetween; and

the coolant chamber volume is in fluid communication with the inlet opening and the outlet opening.

17 . The device package of claim 2 , wherein the integrated cooling assembly comprising plural semiconductor devices and the cold plate is attached to the plural semiconductor devices.

18 . The device package of claim 2 , wherein:

the upper cavity dividers define two longitudinal upper cavity volumes;

the lower cavity dividers define three longitudinal lower cavity volumes orthogonal to the longitudinal upper cavity volumes;

a first lower cavity volume overlaps with a first upper cavity volume only;

a second lower cavity volume overlaps with a second upper cavity volume only; and

a third lower cavity volume overlaps with both the first and the second upper cavity volumes.

19 . The device package of claim 2 , wherein the cold plate is attached to the semiconductor device by direct hybrid bonds.

20 . The device package of claim 2 , wherein:

the upper cavity volumes and the lower cavity volumes collectively define a coolant chamber volume therebetween; and

the device package further comprises upper and lower cavity separators to define a plurality of channels through the coolant chamber volume.

21 . The device package of claim 2 , wherein the upper cavity dividers and the lower cavity dividers alternate across a horizontal length of the cold plate.