Patent Assignment
Reel/Frame 069812/0319
Assignment of Assignor's Interest
Recorded: 2025-01-10
Pages: 5
Assignors
FOUNTAIN, GAIUS GILLMAN, JR.
Executed: 2024-10-17
HABA, BELGACEM
Executed: 2024-10-17
BANG, KYONG-MO
Executed: 2024-10-17
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(3)
Integrated Cooling Assemblies for Advanced Device Packaging and Methods of Manufacturing the Same
Integrated Cooling Assemblies for Advanced Device Packaging and Methods of Manufacturing the Same
Application:
18/952,852 →
Publication:
US 2025/0233053
Integrated Cooling Assemblies for Advanced Device Packaging and Methods of Manufacturing the Same
Application:
63/467,274 →
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.