IP Library › Granted Patent US 802,545
Granted Patent S1
US 802,545 · App. 29/544,071 · Granted Nov 14, 2017

Lower chamber for a plasma processing apparatus

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Quick Facts
Patent No.
US 802,545
App. No.
29/544,071
Granted
Nov 14, 2017
Kind
S1
Claims (1)

The ornamental design for a lower chamber for a plasma processing apparatus, as shown and described.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2015
From: TAUCHI, SUSUMU; UEMURA, TAKASHI; SATO, KOHEI
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 037383/0195 →