Granted Patent
S1
US 1,085,863 · App. 29/652,373 · Granted Jul 29, 2025
Package
Inventors:
Hyunjun Yang (Seoul, KR); Yunhwan Kim (Seoul, KR); Deokhun Moon (Seoul, KR); Goeun Lee (Seoul, KR)
Assignee:
SPIGEN KOREA CO., LTD.
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Claims (1)
The ornamental design for a package as shown and described.
Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Aug 18, 2021
From: YANG, HYUNJUN
To: SPIGEN KOREA CO., LTD.
Reel/Frame 057207/0526 →
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Aug 18, 2021
From: KIM, YUNHWAN
To: SPIGEN KOREA CO., LTD.
Reel/Frame 057207/0530 →
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Aug 18, 2021
From: MOON, DEOKHUN
To: SPIGEN KOREA CO., LTD.
Reel/Frame 057208/0580 →
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Aug 18, 2021
From: LEE, GOEUN
To: SPIGEN KOREA CO., LTD.
Reel/Frame 057208/0584 →
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