IP Library › Granted Patent US 916,038
Granted Patent S1
US 916,038 · App. 29/706,143 · Granted Apr 13, 2021

Grounded electrode for a plasma processing apparatus

Inventor: Taku Watanabe (Tokyo, JP)
Assignee: Hitachi High-Tech Corporation
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Quick Facts
Patent No.
US 916,038
App. No.
29/706,143
Granted
Apr 13, 2021
Kind
S1
Claims (1)

The ornamental design for a grounded electrode for a plasma processing apparatus, as shown and described.

Assignments (2)
CHANGE OF NAME Recorded Apr 14, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052398/0249 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 14, 2019
From: WATANABE, TAKU
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 051004/0590 →
Priority Claims (1)
JP 2019-005889 · Mar 19, 2019 · national