IP Library › Granted Patent US 1,057,674
Granted Patent S1
US 1,057,674 · App. 29/884,199 · Granted Jan 14, 2025

Light emitting chip scale package

Inventor: Edward Bailey (Rochester Hills, MI)
Assignee: Autosystems, a division of Magna Exteriors Inc.
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Quick Facts
Patent No.
US 1,057,674
App. No.
29/884,199
Granted
Jan 14, 2025
Kind
S1
Claims (1)

The ornamental design for a light emitting chip scale package as shown and described.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 5, 2026
From: AUTOSYSTEMS, A DIVISION OF MAGNA EXTERIORS INC.
To: AUTOSYSTEMS BELLEVILLE INC.
Reel/Frame 075537/0368 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 10, 2023
From: BAILEY, EDWARD
To: AUTOSYSTEMS, A DIVISION OF MAGNA EXTERIORS INC.
Reel/Frame 062649/0214 →
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