IP Library Granted Patent US 1,122,216
Granted Patent S1
US 1,122,216 · App. 29/904,232 · Granted Apr 14, 2026

Substrate carrier

Inventors: Bhaskar Prasad (Adityapur, IN); Thomas Brezoczky (Los Gatos, CA); Kirankumar Neelasandra Savandaiah (Bangalore, IN); Aditya Kumar (Bangalore, IN); Vijet Patil (Bangalore, IN)
Assignee: Applied Materials, Inc.
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Quick Facts
Patent No.
US 1,122,216
App. No.
29/904,232
Granted
Apr 14, 2026
Kind
S1
Claims (1)

The ornamental design for a substrate carrier as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 6, 2023
From: PRASAD, BHASKAR; BREZOCZKY, THOMAS; SAVANDAIAH, KIRANKUMAR NEELASANDRA; KUMAR, ADITYA; PATIL, VIJET
To: APPLIED MATERIALS, INC.
Reel/Frame 065465/0702 →
References Cited (139)
US 5180048A · Kawada et al. · 1993 [cited by applicant]
US 5569350A · Osada et al. · 1996 [cited by applicant]
US 5641054A · Mori et al. · 1997 [cited by applicant]
US 6157106A · Tietz et al. · 2000 [cited by applicant]
US 6206176B1 · Blonigan et al. · 2001 [cited by applicant]
US 6231716B1 · White et al. · 2001 [cited by applicant]
US D535264S · Lai · 2007 [cited by examiner]
US 7293950B2 · Bonora et al. · 2007 [cited by applicant]
US 7438175B2 · White et al. · 2008 [cited by applicant]
US D611039S · Deguchi · 2010 [cited by examiner]
US 7841820B2 · Bonora et al. · 2010 [cited by applicant]
US 7948122B2 · Compter et al. · 2011 [cited by applicant]
US 7964038B2 · Patalay et al. · 2011 [cited by applicant]
US 7994486B2 · Smick et al. · 2011 [cited by applicant]
US 8104951B2 · Aderhold et al. · 2012 [cited by applicant]
US D713827S · Forster · 2014 [cited by examiner]
US 8851817B2 · Bonora et al. · 2014 [cited by applicant]
US 9390950B2 · Sorabji et al. · 2016 [cited by applicant]
US 9588443B2 · Shibazaki · 2017 [cited by applicant]
US D794001S · Ota · 2017 [cited by examiner]
US D812597S · Forster · 2018 [cited by examiner]
US 9964863B1 · Babayan et al. · 2018 [cited by applicant]
US D832229S · Podubni · 2018 [cited by examiner]
US 10204810B2 · Hoey et al. · 2019 [cited by applicant]
US 10236197B2 · Janakiraman et al. · 2019 [cited by applicant]
US 10256124B2 · Mooring · 2019 [cited by applicant]
US 10262887B2 · Hao et al. · 2019 [cited by applicant]
US 10283397B2 · Willwerth et al. · 2019 [cited by applicant]
US 10460977B2 · Breninger et al. · 2019 [cited by applicant]
US D866536S · Forster · 2019 [cited by examiner]
US 10483141B2 · Janakiraman et al. · 2019 [cited by applicant]
US 10490436B2 · Ghosh et al. · 2019 [cited by applicant]
US 10734265B2 · Janakiraman et al. · 2020 [cited by applicant]
US 10770337B2 · Lee et al. · 2020 [cited by applicant]
US 10784142B2 · Marcelynas et al. · 2020 [cited by applicant]
US 10851453B2 · Tsai et al. · 2020 [cited by applicant]
US 10892180B2 · Chia et al. · 2021 [cited by applicant]
US D933257S · Fukuzawa · 2021 [cited by examiner]
US 11232965B2 · Newman et al. · 2022 [cited by applicant]
US 11377310B2 · Aust et al. · 2022 [cited by applicant]
US D959393S · Sugiura · 2022 [cited by examiner]
US 11508595B2 · Aust et al. · 2022 [cited by applicant]
US 11527424B2 · Berger et al. · 2022 [cited by applicant]
US 20020018842A1 · Dunlow · 2002 [cited by applicant]
US 20030178145A1 · Anderson et al. · 2003 [cited by applicant]
US 20030219977A1 · Pomarede et al. · 2003 [cited by applicant]
US 20040023495A1 · Butterfield et al. · 2004 [cited by applicant]
US 20040058293A1 · Nguyen et al. · 2004 [cited by applicant]
US 20040255442A1 · McDiarmid et al. · 2004 [cited by applicant]
US 20060102078A1 · Fairbairn et al. · 2006 [cited by applicant]
US 20060156981A1 · Fondurulia et al. · 2006 [cited by applicant]
US 20070160507A1 · Satoh et al. · 2007 [cited by applicant]
US 20070269297A1 · Meulen et al. · 2007 [cited by applicant]
US 20080175694A1 · Park et al. · 2008 [cited by applicant]
US 20080232947A1 · van der Meulen et al. · 2008 [cited by applicant]
US 20080266037A1 · Williams · 2008 [cited by applicant]
US 20090314211A1 · Du Bois et al. · 2009 [cited by applicant]
US 20100062592A1 · Clark · 2010 [cited by applicant]
US 20100136773A1 · Akae et al. · 2010 [cited by applicant]
US 20100226737A1 · Sakaue et al. · 2010 [cited by applicant]
US 20110312189A1 · Kim et al. · 2011 [cited by applicant]
US 20120109355A1 · Baccini et al. · 2012 [cited by applicant]
US 20120213614A1 · Bonora et al. · 2012 [cited by applicant]
US 20120249291A1 · Holcomb et al. · 2012 [cited by applicant]
US 20130171757A1 · Ponnekanti et al. · 2013 [cited by applicant]
US 20140020629A1 · Tsai et al. · 2014 [cited by applicant]
US 20180339816A1 · Oldendorf et al. · 2018 [cited by applicant]
US 20180374732A1 · Klein et al. · 2018 [cited by applicant]
US 20190348264A1 · Tsai et al. · 2019 [cited by applicant]
US 20200026060A1 · Takato · 2020 [cited by applicant]
US 20200232088A1 · White et al. · 2020 [cited by applicant]
US 20200262060A1 · Hosek et al. · 2020 [cited by applicant]
US 20200262660A1 · Hosek et al. · 2020 [cited by applicant]
US 20200381276A1 · Yedla et al. · 2020 [cited by applicant]
US 20210024929A1 · Yokota et al. · 2021 [cited by applicant]
US 20210249291A1 · Raatz et al. · 2021 [cited by applicant]
US 20210265188A1 · Moura et al. · 2021 [cited by applicant]
US 20210296150A1 · Berger et al. · 2021 [cited by applicant]
US 20210328146A1 · Heymanns et al. · 2021 [cited by applicant]
US 20210354934A1 · Aust et al. · 2021 [cited by applicant]
US 20220003718A1 · Watanabe · 2022 [cited by applicant]
US 20220013383A1 · Savandaiah et al. · 2022 [cited by applicant]
US 20220037181A1 · Hatano et al. · 2022 [cited by applicant]
US 20220130700A1 · Newman et al. · 2022 [cited by applicant]
US 20220208426A1 · Aust et al. · 2022 [cited by applicant]
US 20220293451A1 · Sulyman et al. · 2022 [cited by applicant]
US 20220293452A1 · Sulyman et al. · 2022 [cited by applicant]
US 20220336258A1 · Srivastava et al. · 2022 [cited by applicant]
US 20220393618A1 · Aust et al. · 2022 [cited by applicant]
US 20220415635A1 · Yedla et al. · 2022 [cited by applicant]
US 20220415687A1 · Hatano et al. · 2022 [cited by applicant]
US 20220415688A1 · Hatano et al. · 2022 [cited by applicant]
US 20230132174A1 · Thanu et al. · 2023 [cited by applicant]
CN 101158852A · 2008 [cited by applicant]
CN 303151003 · 2015 [cited by examiner]
CN 113707585A · 2021 [cited by applicant]
DE 102018006259A1 · 2019 [cited by applicant]
EP 1681261A1 · 2006 [cited by applicant]
EP 4222779A1 · 2023 [cited by applicant]
JP 62121134A · 1987 [cited by applicant]
JP H06324297A · 1994 [cited by applicant]
KR 3009927140000 · 2019 [cited by examiner]
KR 1020210081597A · 2021 [cited by applicant]
KR 20220099611A · 2022 [cited by applicant]
KR 1020220099611A · 2022 [cited by applicant]
TW 202141675A · 2021 [cited by applicant]
WO 2008077048A2 · 2008 [cited by applicant]
WO 2011102410A1 · 2011 [cited by applicant]
WO 2015007385A1 · 2015 [cited by applicant]
WO 2015043712A1 · 2015 [cited by applicant]
WO 2015140155A1 · 2015 [cited by applicant]
WO 2015158725A1 · 2015 [cited by applicant]
WO 2015162177A1 · 2015 [cited by applicant]
WO 2015189263A1 · 2015 [cited by applicant]
WO 2016162288A1 · 2016 [cited by applicant]
WO 2019037858A1 · 2019 [cited by applicant]
WO 2019052657A1 · 2019 [cited by applicant]
WO 2019145035A1 · 2019 [cited by applicant]
WO 2019238416A1 · 2019 [cited by applicant]
WO 2020126040A1 · 2020 [cited by applicant]
WO 2020192911A1 · 2020 [cited by applicant]
WO 2021106796A1 · 2021 [cited by applicant]
WO 2021106799A1 · 2021 [cited by applicant]
WO 2021223843A1 · 2021 [cited by applicant]
WO 2022044834A1 · 2022 [cited by applicant]
Substrate Clean Carrier, date posted unavailable, data retrieved from the internet at https://www.wdtc.com.tw/products1_detail.php?cID=2&Key=13 (Year: 2025). [cited by examiner]
U.S. Appl. No. 18/081,493, filed Dec. 14, 2022. [cited by applicant]
U.S. Appl. No. 18/141,909, filed May 1, 2023. [cited by applicant]
U.S. Appl. No. 18/141,914, filed May 1, 2023. [cited by applicant]
U.S. Appl. No. 18/141,920, filed May 1, 2023. [cited by applicant]
U.S. Appl. No. 18/141,923, filed May 1, 2023. [cited by applicant]
U.S. Appl. No. 18/141,926, filed May 1, 2023. [cited by applicant]
U.S. Appl. No. 18/141,931, filed May 1, 2023. [cited by applicant]
International Search Report and Written Opinion in related application PCT/US2023/035709 dated Feb. 5, 2024. [cited by applicant]
International Search Report/ Written Opinion issued to PCT/US2023/079455 on Mar. 6, 2024. [cited by applicant]
Yu et al.; Controller design and implementation of six-degree-of-freedom magnetically levitated positioning system with high precision; Proc. IMechE vol. 222 Part I: J. Systems and Control Engineering; 12 pages. [cited by applicant]
Zhu et al; Design and Control of a Six Degrees-of-Freedom Magnetically Levitated Positioning System; IFAC PapersOnLine 49-21 (2016) pp. 127-132. [cited by applicant]
Temposonics; Sensor Selector Guide; Retrieved from the Internet at: < https://www.temposonics.com/docs/temposonicslibraries/literature/sensor_selector_guide_industrial_551814_en.pdf?sfvrsn=5fde8874_12>; 21 pages. [cited by applicant]
Linear Motion Tips; How do Magnettostrictive sensors work?; Retrieved from the Internet at: <https://www.linearmotiontips.com/how-do-magnetostrictive-sensors-work/> 9 Pages. [cited by applicant]