IP Library Patent Application 60518434
Patent Application Provisional
App. No. 60/518,434 · Confirmation No. 2547

Flip chip interconnection pad layout

Inventor: Rajendra D. Pendse
Provisional Application Expired
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Code Description Pages PDF
2003-11-08 TRNA Transmittal of New Application 1 View
2003-11-08 SPEC Specification 11 View
2003-11-08 CLM Claims 1 View
2003-11-08 ABST Abstract 1 View
2003-11-08 DRW Drawings-only black and white line drawings 6 View
2003-11-08 ADS Application Data Sheet 3 View
2003-11-08 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
60/518,434
Filed
2003-11-08