Patent Application
Provisional
App. No. 60/595,822
· Confirmation No. 3785
INTEGRATED CIRCUIT PACKAGE SYSTEM USING INTERPOSER
Provisional Application Expired
|
⬇ PDF
|
Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2005-08-08 | ADS |
Application Data Sheet | 3 | View | |
| 2005-08-08 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2005-08-08 | TRNA |
Transmittal of New Application | 2 | View | |
| 2005-08-08 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2005-08-08 | SPEC |
Specification | 7 | View | |
| 2005-08-08 | CLM |
Claims | 1 | View | |
| 2005-08-08 | ABST |
Abstract | 1 | View | |
| 2005-08-08 | DRW |
Drawings-only black and white line drawings | 3 | View |
Inventors
Il Kwon Shim
Singapore, SINGAPORE
Byung Joon Han
Singapore, SINGAPORE
Seng Guan Chow
Singapore, SINGAPORE
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22898
- Docket No.
- 27-180P
- Confirmation No.
- 3785
No recorded assignments were found for this patent.
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
- App. No.
- 60/595,822
- Filed
- 2005-08-08
External Links