INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM
An integrated circuit package-on-package stacking system is provided including providing a first integrated circuit package, mounting a metalized interposer substrate over the first integrated circuit package and attaching a second integrated circuit package on the metalized interposer substrate.
1 . An integrated circuit package-on-package stacking system comprising:
providing a first integrated circuit package;
mounting a metalized interposer substrate over the first integrated circuit package; and
attaching a second integrated circuit package on the metalized interposer substrate.
2 . The system as claimed in claim 1 further comprising providing a transition interconnect on the first integrated circuit package.
3 . The system as claimed in claim 1 further comprising:
providing a contact pad on the metalized interposer substrate; and
coupling a discrete component to the contact pad.
4 . The system as claimed in claim 1 wherein attaching the second integrated circuit package includes providing the second integrated circuit package in which the second integrated circuit package being smaller than the first integrated circuit package.
5 . The system as claimed in claim 1 further comprising providing an electromagnetic shield over the second integrated circuit package, a discrete component, or a combination thereof.
6 . An integrated circuit package-on-package stacking system comprising:
providing a first integrated circuit package having a through conductor;
mounting a metalized interposer substrate over the first integrated circuit package, in which the metalized interposer substrate provides a redistribution layer; and
attaching a second integrated circuit package on the metalized interposer substrate, in which providing a ball pitch for the second integrated circuit package requires less space than for the first integrated circuit package.
7 . The system as claimed in claim 6 further comprising providing a transition interconnect on the first integrated circuit package, in which providing the transition interconnect includes providing a solder ball.
8 . The system as claimed in claim 6 further comprising:
providing a contact pad on the metalized interposer substrate, in which providing a contact pad includes a contact pad on the interposer top and on the interposer bottom; and
coupling a discrete component to the contact pad, in which coupling the discrete component may provide an active component or a passive component.
9 . The system as claimed in claim 6 wherein attaching the second integrated circuit package includes providing the second integrated circuit package in which the second integrated circuit package being smaller than the first integrated circuit package, with the second integrated circuit package including a land grid array, a ball grid array, or a leadless package.
10 . The system as claimed in claim 6 further comprising providing an electromagnetic shield over the second integrated circuit package, a discrete component, or a combination thereof, in which providing the electromagnetic shield includes mounting the electromagnetic shield on the metalized interposer substrate.
11 . An integrated circuit package-on-package stacking system comprising:
a first integrated circuit package;
a metalized interposer substrate over the first integrated circuit package; and
a second integrated circuit package on the metalized interposer substrate.
12 . The system as claimed in claim 11 further comprising a transition interconnect on the first integrated circuit package.
13 . The system as claimed in claim 11 further comprising:
a contact pad on the metalized interposer substrate; and
a discrete component coupled to the contact pad.
14 . The system as claimed in claim 11 wherein the second integrated circuit package on the metalized interposer substrate, includes the second integrated circuit package is smaller than the first integrated circuit package.
15 . The system as claimed in claim 11 further comprising an electromagnetic shield over the second integrated circuit package, a discrete component, or a combination thereof.
16 . The system as claimed in claim 11 further comprising:
a through conductor in the first integrated circuit package;
a redistribution layer; and
a ball pitch for the second integrated circuit package requires less space than for the first integrated circuit package.
17 . The system as claimed in claim 16 further comprising a transition interconnect on the first integrated circuit package, in which the transition interconnect includes a solder ball.
18 . The system as claimed in claim 16 further comprising:
a contact pad on the metalized interposer substrate, includes a contact pad on the interposer top and on the interposer bottom; and
a discrete component coupled to the contact pad, in which the discrete component may provide an active component or a passive component.
19 . The system as claimed in claim 16 wherein the second integrated circuit package attached includes the second integrated circuit package is smaller than the first integrated circuit package, with the second integrated circuit package includes a land grid array, a ball grid array, or a leadless package.
20 . The system as claimed in claim 16 further comprising an electromagnetic shield over the second integrated circuit package, a discrete component, or a combination thereof, in which the electromagnetic shield is mounted on the metalized interposer substrate.