Patent Application
Provisional
App. No. 60/686,116
· Confirmation No. 6315
Epoxy bump for overhang die
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2005-05-31 | TRNA |
Transmittal of New Application | 2 | View | |
| 2005-05-31 | SPEC |
Specification | 6 | View | |
| 2005-05-31 | CLM |
Claims | 1 | View | |
| 2005-05-31 | ABST |
Abstract | 1 | View | |
| 2005-05-31 | DRW |
Drawings-only black and white line drawings | 6 | View | |
| 2005-05-31 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2005-05-31 | ADS |
Application Data Sheet | 4 | View |
Inventors
Hun-Teak Lee
Ichon-si, KOREA, REPUBLIC OF
Jong-Kook Kim
Jungja-dong, KOREA, REPUBLIC OF
Chul-Sik Kim
Ichon-si, KOREA, REPUBLIC OF
Ki-Youn Jang
Incheon, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22470
- Docket No.
- CPAC 1102-1
- Confirmation No.
- 6315
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2006-07-26
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Quick Facts
- App. No.
- 60/686,116
- Filed
- 2005-05-31
External Links