Epoxy bump for overhang die
In a semiconductor assembly having stacked elements, discrete bumps made of a polymer such as an electrically nonconductive epoxy are interposed between the upper surface of a substrate and the lower surface of the overhanging part of an elevated element (die or package) with the discrete bump directly under bond sites on the elevated element.
1. A semiconductor assembly comprising:
a substrate;
a die over the substrate, the die electrically bonded on die first bond sites and die second bond sites on the substrate by first die wire bonds, and the die second bond sites are extended farther away from the die than the die first bond sites;
polymer bumps on the substrate, the polymer bumps are in between the die second bond sites, the polymer bumps are in between the die first bond sites and vertical edges of the substrate; and
an upper die connected to upper die bond sites on the substrate, the upper die having an overhang supported over the substrate by the polymer bumps directly under a portion of bond sites on the overhang, wherein the polymer bumps are on the substrate between the die first bond sites and the upper die bond sites, the die second bond sites and the polymer bumps are immediately adjacent to the upper die bond sites.
2. A semiconductor assembly comprising:
an assembly substrate;
a first die over the assembly substrate, the first die electrically bonded on die first bond sites and die second bond sites on the assembly substrate by first die wire bonds, and the die second bond sites are extended farther away from the die than the die first bond sites;
polymer bumps on the assembly substrate, the polymer bumps are in between the die second bond sites, the polymer bumps are in between the die first bond sites and vertical edges of the assembly substrate; and
a semiconductor part connected to semiconductor part bond sites on the assembly substrate, the semiconductor part mounted in an elevated position in relation to the assembly substrate, wherein an overhang of the semiconductor part is supported by one or more of the polymer bumps directly under a portion of bond sites on the overhang, wherein the polymer bumps are on the assembly substrate between the die first bond sites and the semiconductor part bond sites, the die second bond sites and the polymer bumps are immediately adjacent to the semiconductor part bond sites.
3. The semiconductor assembly as claimed in claim 2 wherein the semiconductor part includes a semiconductor die.
4. The semiconductor assembly as claimed in claim 2 wherein the semiconductor part is a package die attached and electrically interconnected with a package substrate.
5. The semiconductor assembly as claimed in claim 3 wherein the semiconductor die is electrically interconnected to the assembly substrate by wire bonds.
6. The semiconductor assembly as claimed in claim 2 further comprising a package is electrically interconnected to the assembly substrate by wire bonds.
7. The semiconductor assembly as claimed in claim 2 wherein the first die is mounted on a die attach side of the assembly substrate and the semiconductor part is stacked over the first die.
8. The semiconductor assembly as claimed in claim 2 wherein the first die is affixed to a die mount region of a die attach side of the assembly substrate.
9. The semiconductor assembly as claimed in claim 2 further comprising a spacer between the first die and the semiconductor part.
10. The semiconductor assembly as claimed in claim 2 wherein the first die is mounted in a flip chip manner to a die mount region of a die attach side of the assembly substrate.
11. A method for making a semiconductor assembly, comprising:
mounting a lower semiconductor part including a first die on a first side of an assembly substrate, the lower semiconductor part is electrically bonded on first semiconductor bond sites and second semiconductor bond sites on the assembly substrate by first semiconductor wire bonds, and the second semiconductor bond sites are extended farther away from the die than the first semiconductor bond sites;
depositing discrete epoxy bumps on the first side of the assembly substrate in between the second semiconductor bond sites, the discrete epoxy bumps are in between the first semiconductor bond sites and vertical edges of the assembly substrate; and
mounting an upper semiconductor part connected to upper semiconductor part bond sites on the assembly substrate, the upper semiconductor part bonded over the lower semiconductor part and on the discrete epoxy bumps, the upper semiconductor part having an overhang directly over a portion of the discrete epoxy bumps, wherein the discrete epoxy bumps are on the assembly substrate between the first semiconductor bond sites and the upper semiconductor part bond sites, the second semiconductor bond sites and the discrete epoxy bumps are immediately adjacent to the upper semiconductor part bond sites.
12. The method as claimed in claim 11 wherein the first wire bonds have different lengths.
13. The method as claimed in claim 11 wherein mounting the lower semiconductor part comprises forming a flip chip interconnection between a flip chip die and the assembly substrate.
14. The method as claimed in claim 11 wherein mounting the lower semiconductor part includes mounting a die.
15. The method as claimed in claim 11 further comprising, prior to mounting the upper semiconductor part, affixing a die spacer on the lower semiconductor part, and wherein mounting the upper semiconductor part includes affixing the upper semiconductor part on the die spacer.
16. The method as claimed in claim 11 wherein mounting the upper semiconductor part includes affixing a die onto a die spacer.
17. The method as claimed in claim 11 wherein mounting the upper semiconductor part includes affixing a semiconductor package onto a die spacer, the semiconductor package includes a package die affixed to a package substrate.