Patent Assignment
Reel/Frame 018005/0701
Assignment of Assignor's Interest
Recorded: 2006-07-26
Pages: 4
Assignors
LEE, HUN TEAK
Executed: 2006-06-19
KIM, JONG KOOK
Executed: 2006-06-19
KIM, CHUL SIK
Executed: 2006-06-19
JANG, KI YOUN
Executed: 2006-06-19
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Properties
(2)
Epoxy Bump for Overhang Die
Epoxy bump for overhang die
Application:
60/686,116 →
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0442 →
Corrective Assignment to Correct the Assignor's Name Previously Recorded on Reel 038378 Frame 0442. Assignor(S) Hereby Confirms the Change of Name.
Jul 26, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 039514/0451 →
Corrective Assignment to Correct the Assignor Name Previously Recorded at Reel: 039514 Frame: 0451. Assignor(S) Hereby Confirms the Change of Name.
Aug 26, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 039980/0838 →
Release of Security Interest
Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053476/0094 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →