Patent Application
Provisional
App. No. 60/714,214
· Confirmation No. 2637
Heat dissipation in integrated circuits
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2022-04-15 | OATH |
Oath or Declaration filed | 236 | View | |
| 2005-09-02 | TRNA |
Transmittal of New Application | 1 | View | |
| 2005-09-02 | SPEC |
Specification | 3 | View | |
| 2005-09-02 | CLM |
Claims | 1 | View | |
| 2005-09-02 | DRW |
Drawings-only black and white line drawings | 2 | View | |
| 2005-09-02 | WFEE |
Fee Worksheet (SB06) | 1 | View |
Inventors
Cynthia C. Lee
Allentown, PA
Sidhartha Sen
Allentown, PA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 49382
- Docket No.
- Lee 6-13/458
- Confirmation No.
- 2637
RELEASE OF SECURITY INTEREST
Recorded 2022-04-15
SECURITY INTEREST
Recorded 2018-02-01
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2017-12-17
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Quick Facts
- App. No.
- 60/714,214
- Filed
- 2005-09-02
External Links