Patent Application
Provisional
App. No. 60/848,973
· Confirmation No. 2619
Method for fabricating a backside through-wafer via in a processed wafer and related structure
Provisional Application Expired
Inventors
Attorneys & Agents of Record
Prosecution
- Customer No.
- 25700
- Docket No.
- 0150151P
- Confirmation No.
- 2619
Child
Claims priority from a provisional application
→
App. 11/787,066
Filed 2007-04-13
· Abandoned -- Failure to Respond to an Office Action
Child
Claims priority from a provisional application
→
App. 11/787,063
· US 8,212,331
Filed 2007-04-13
· Patented Case
Child
Claims priority from a provisional application
→
App. 11/787,024
Filed 2007-04-13
· Abandoned -- Failure to Respond to an Office Action
RELEASE OF SECURITY INTEREST
Recorded 2023-10-18
from
NEWPORT FAB, LLC
FIRST AMENDMENT TO PATENT SECURITY AGREEMENT
Recorded 2007-04-04
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
- App. No.
- 60/848,973
- Filed
- 2006-10-02
External Links