IP Library Patent Application 60863071
Patent Application Provisional Small
App. No. 60/863,071 · Confirmation No. 3521

SOLID HIGH ASPECT RATIO VIA HOLE USED FOR BURN-IN BOARDS, WAFER SORT PROBE CARDS, AND PACKAGE TEST LOAD BOARDS WITH ELECTRONIC CIRCUITRY

Inventor: Romi O. Mayder
Provisional Application Expired
⬇ PDF
Code Description Pages PDF
2006-12-28 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2006-11-15 APP.FILE.REC Filing Receipt 3 View
2006-10-26 ADS Application Data Sheet 4 View
2006-10-26 SPEC Specification 7 View
2006-10-26 WFEE Fee Worksheet (SB06) 2 View
2006-10-26 N417 Electronic Filing System Acknowledgment Receipt 2 View
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Quick Facts
App. No.
60/863,071
Filed
2006-10-26