Patent Application
Provisional
Small
App. No. 60/919,521
· Confirmation No. 7981
Fully tested wafers having bond pads undamaged by probing and applications thereof
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2007-07-19 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2007-07-10 | PEFR |
Applicant Response to Pre-Exam Formalities Notice | 4 | View | |
| 2007-05-07 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2007-03-22 | TRNA |
Transmittal of New Application | 2 | View | |
| 2007-03-22 | SPEC |
Specification | 8 | View | |
| 2007-03-22 | ABST |
Abstract | 1 | View | |
| 2007-03-22 | DRW |
Drawings-only black and white line drawings | 1 | View |
Inventors
Morgan T. Johnson
Portland, OR
Raymond J. Werner
Portland, OR
Attorneys & Agents of Record
Prosecution
- Customer No.
- 41536
- Docket No.
- Octavian.P031Z
- Confirmation No.
- 7981
RELEASE OF SECURITY INTEREST
Recorded 2021-04-07
SECURITY INTEREST
Recorded 2009-09-21
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Quick Facts
- App. No.
- 60/919,521
- Filed
- 2007-03-22
External Links