IP Library › Patent Application 60965184
Patent Application Provisional Small
App. No. 60/965,184 · Confirmation No. 6294

Stacked die vertical interconnect formed by transfer of interconnect material

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2007-08-29 APP.FILE.REC Filing Receipt 3 View
2007-08-17 TRNA Transmittal of New Application 3 View
2007-08-17 SPEC Specification 9 View
2007-08-17 CLM Claims 1 View
2007-08-17 ABST Abstract 1 View
2007-08-17 DRW Drawings-only black and white line drawings 7 View
2007-08-17 WFEE Fee Worksheet (SB06) 1 View
2007-08-17 ADS Application Data Sheet 6 View
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Quick Facts
App. No.
60/965,184
Filed
2007-08-17