IP Library Patent Application 61150721
Patent Application Provisional Small
App. No. 61/150,721 · Confirmation No. 9999

ELECTROPLATING METHODS AND CHEMISTRIES FOR DEPOSITION OF COPPER-INDIUM-GALLIUM CONTAINING THIN FILMS

Provisional Application Expired
⬇ PDF
Code Description Pages PDF
2009-02-25 APP.FILE.REC Filing Receipt 3 View
2009-02-06 TR.PROV Provisional Cover Sheet (SB16) 2 View
2009-02-06 SPEC Specification 13 View
2009-02-06 DRW Drawings-only black and white line drawings 1 View
2009-02-06 WFEE Fee Worksheet (SB06) 2 View
2009-02-06 N417 Electronic Filing System Acknowledgment Receipt 2 View
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Quick Facts
App. No.
61/150,721
Filed
2009-02-06