IP Library › Patent Application 61264614
Patent Application Provisional Small
App. No. 61/264,614 · Confirmation No. 2318

Systems, methods and products including laser cleaving of silicon and other substrates/layers

Provisional Application Expired
⬇ PDF
Code Description Pages PDF
2009-12-30 APP.FILE.REC Filing Receipt 3 View
2009-12-23 WFEE Fee Worksheet (SB06) 1 View
2009-12-02 ADS Application Data Sheet 4 View
2009-12-02 N417 Electronic Filing System Acknowledgment Receipt 2 View
2009-11-25 TR.PROV Provisional Cover Sheet (SB16) 2 View
2009-11-25 SPEC Specification 6 View
2009-11-25 DRW Drawings-only black and white line drawings 3 View
2009-11-25 N417 Electronic Filing System Acknowledgment Receipt 2 View
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Quick Facts
App. No.
61/264,614
Filed
2009-11-25