IP Library › Patent Application 61354682
Patent Application Provisional Small
App. No. 61/354,682 · Confirmation No. 1261

Systems, Methods and Products Including Features of Bonding and/or Cleaving Silicon to Silicon Containing Layers on Substrates

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2010-07-09 APP.FILE.REC Filing Receipt 3 View
2010-06-14 TR.PROV Provisional Cover Sheet (SB16) 2 View
2010-06-14 SPEC Specification 6 View
2010-06-14 DRW Drawings-only black and white line drawings 3 View
2010-06-14 WFEE Fee Worksheet (SB06) 2 View
2010-06-14 N417 Electronic Filing System Acknowledgment Receipt 2 View
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Quick Facts
App. No.
61/354,682
Filed
2010-06-14