IP Library › Patent Application 61519902
Patent Application Provisional
App. No. 61/519,902 · Confirmation No. 6323

Semi-aqueous polymer removal compositions with enhanced compatibility to copper, tungsten, and porous low-k dielectrics

Provisional Application Expired
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 Code Description Pages PDF
2023-08-09 MF.AD.PAIR Maintenance Fee Address Change for PAIR 1 View
2011-06-22 APP.FILE.REC Filing Receipt 3 View
2011-06-01 TRNA Transmittal of New Application 4 View
2011-06-01 SPEC Specification 12 View
2011-06-01 CLM Claims 5 View
2011-06-01 ABST Abstract 1 View
2011-06-01 DRW Drawings-only black and white line drawings 4 View
2011-06-01 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
61/519,902
Filed
2011-06-01