IP Library Assignment 026499/0256
Patent Assignment
Reel/Frame 026499/0256

Patent Security Agreement

Recorded: 2011-06-24 Received: 2011-06-24 Pages: 11
Assignor
Assignee
CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
ELEVEN MADISON AVENUE, NEW YORK, NY, 10010, UNITED STATES
Covered Properties (47)
Directly Compressible Granular Microcrystalline Cellulose Based, Excipient, Manufacturing Process and Use Thereof
Application: 12/998,659 →
Semi-aqueous polymer removal compositions with enhanced compatibility to copper, tungsten, and porous low-k dielectrics
Application: 61/519,902 →
Integrated Document Delivery Method and Apparatus
Application: 13/116,950 →
New Chromatographic Media Based on Phenoxy Alkyl and Alkoxy-or Phenoxy-Phenyl Alkyl Ligands
Application: 12/998,656 →
Directly Compressible High Functionality Granular Dibasic Calcium Phosphate Based Co-Processed Excipient
Application: 12/998,655 →
Separation of protein monomers from aggregates by solid weak anion exchange support functionalized with amine moieties
Application: 61/518,305 →
Novel chromatographic media based on allylamine and its derivative for protein purification
Application: 61/518,258 →
Non-aqueous, non-corrosive microelectronic cleaning compositions containing polymeric corrosion inhibitors
Application: 13/066,889 →
Gluconic Acid Containing Photoresist Cleaning Composition for Multi-Metal Device Processing
Application: 12/998,499 →
Aqueous Acidic Formulations for Copper Oxide Etch Residue Removal and Prevention of Copper Electrodeposition
Application: 12/998,296 →
Sustained Release Composition
Application: 12/737,663 →
Driectly Compressible High Functionality Granular Microcrystalline Cellulose Based Excipient, Manufacturing Process and Use Thereof
Application: 12/600,369 →
Methods and Processes to Recover Voltage Loss of Pem Fuel Cell Stack
Application: 12/939,867 →
Post Plasma Etch/Ash Residue and Silicon-Based Anti-Reflective Coating Remover Compositions Containing Tetrafluoroborate Ion
Application: 12/811,257 →
Metal Sulfide Deposition Using Alkylated Thioureas
Application: 61/357,146 →
Directly Compressible Granular Microcrystalline Cellulose Based Excipient, Manufacturing Process and Use Thereof
Application: 12/619,259 →
Polysilicon Planarization Solution for Planarizing Low Temperature Poly-Silicon Thin Film Panels
Application: 12/596,921 →
High Efficiency Chromatography Column with Re-usable End Cap
Application: 12/565,172 →
Peroxide Activated Oxometalate Based Formulations for Removal of Etch Residue
Application: 12/522,716 →
Chromatographic Media and Chromatographic Equipment Storage Solutions and Use Thereof
Application: 12/522,605 →
Multipurpose Acidic, Organic Solvent Based Microelectronic Cleaning Composition
Application: 61/155,309 →
Stabilized, Non-Aqueous Cleaning Compositions for Microelectronics Substrates
Application: 12/161,886 →
Vegetarian Protein A Preparation and Methods Thereof
Application: 12/046,582 →
Compositions for the Removal of Post-Etch and Ashed Photoresist Residues and Bulk Photoresist
Application: 11/911,346 →
Non-Aqueous Photoresist Stripper That Inhibits Galvanic Corrosion
Application: 11/910,281 →
Compositions for Cleaning Ion Implanted Photoresist in Front End of Line Applications
Application: 11/817,874 →
Chromatographic Media
Application: 11/813,434 →
Microelectronic Cleaning Compositions Containing Ammonia-Free Fluoride Salts for Selective Photoresist Stripping and Plasma Ash Residue Cleaning
Application: 11/762,087 →
Non-Aqueous, Non-Corrosive Microelectronic Cleaning Compositions
Application: 11/720,084 →
Non-Aqueous, Non-Corrosive Microelectronic Cleaning Compositions Containing Polymeric Corrosion Inhibitors
Application: 11/719,690 →
Preparation of Ultrapure Polymeric Articles
Application: 11/631,586 →
Non-Aqueous Microelectronic Cleaning Compositions Containing Fructose
Application: 11/630,602 →
Cleaning Compositions for Microelectronic Substrates
Application: 11/630,603 →
Purified vegetarian protein A and process for production thereof
Application: 11/521,246 →
Nanoelectronic and Microelectronic Cleaning Compositions
Application: 10/584,827 →
Alkaline, Post Plasma Etch/Ash Residue Removers and Photoresist Stripping Compositions Containing Metal-Halide Corrosion Inhibitors
Application: 10/572,860 →
Stripping and Cleaning Compositions for Microelectronics
Application: 11/349,635 →
Vegetarian Protein a Preparation and Methods Thereof
Application: 11/194,093 →
Microelectronic Cleaning Compositions Containing Oxidizers and Organic Solvents
Application: 10/515,392 →
Microelectronic cleaning and arc remover compositions
Application: 10/515,372 →
Microelectronic Cleaning Composition Containing Halogen Oxygen Acids, Salts and Derivatives Thereof
Application: 10/982,330 →
Microelectronic Cleaning Compositions Containing Ammonia-Free Fluoride Salts
Application: 10/483,036 →
Ammonia-Free Alkaline Microelectronic Cleaning Compositions with Improved Substrate Compatibility
Application: 10/483,037 →
Functionalized Polymeric Media for Separation of Analytes
Application: 10/250,570 →
Method and Composition for Removing Sodium-Containing Material from Microcircuit Substrates
Application: 10/220,720 →
Photoresist Strippers Containing Reducing Agents to Reduce Metal Corrosion
Application: 09/968,665 →
Stabilized Alkaline Compositions for Cleaning Microlelectronic Substrates
Application: 09/859,142 →