Non-aqueous, non-corrosive microelectronic cleaning compositions

Back end photoresist strippers and cleaning compositions of this invention are provided by amino acid-free, non-aqueous cleaning compositions that are essentially non-corrosive toward copper as well as aluminum and that comprise at least one polar organic solvent, at least one hydroxylated organic amine, and at least one corrosion inhibitor compound with multiple hydroxyl functional groups that is a compound of the formula: T 1 -[(CR 1 R 2 ) m —(CR 3 R 4 ) n ] p —(CR 5 R 6 ) q -T 2 where at least one of R 1 and R 2 OH and if one of R 1 and R 2 is not OH, it is selected from H, alkyl or alkoxy, m is a whole integer of 1 or greater, R 3 and R 4 are selected from H, alkyl or alkoxy, n is 0 or a greater whole positive integer, p is a whole integer of 1 or greater; at least one of R 5 and R 6 is OH and if one of R 5 and R 6 is not OH, it is selected from H, alkyl or alkoxy, q is a whole integer of 1 or greater; T 1 and T 2 are selected from H, alkyl, hydroxyalkyl, polyhydroxyalkyl, aminoalkyl, carbonylalkyl or amide groups or T 1 and T 2 may be connected forming a structure selected from an aliphatic cyclic or fused cyclic structure.