IP Library › Patent Application 61655431
Patent Application Provisional
App. No. 61/655,431 · Confirmation No. 1078

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE AND METHOD OF MANUFACTURE THEREOF

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2013-03-15 OATH Oath or Declaration filed 9 View
2012-06-22 APP.FILE.REC Filing Receipt 3 View
2012-06-04 ADS Application Data Sheet 5 View
2012-06-04 SPEC Specification 9 View
2012-06-04 CLM Claims 1 View
2012-06-04 ABST Abstract 1 View
2012-06-04 DRW.NONBW Drawings-other than black and white line drawings 3 View
2012-06-04 TR.PROV Provisional Cover Sheet (SB16) 3 View
2012-06-04 WFEE Fee Worksheet (SB06) 2 View
2012-06-04 N417 Electronic Filing System Acknowledgment Receipt 3 View
2012-06-04 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
0001-01-03 DRW.SUPP Drawings-black and white line and/or other drawings — View
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Quick Facts
App. No.
61/655,431
Filed
2012-06-04