Patent Assignment
Reel/Frame 030023/0017
Assignment of Assignor's Interest
Recorded: 2013-03-15
Pages: 9
Assignors
LIN, YAOJIAN
Executed: 2013-03-13
SHIM, IL KWON
Executed: 2013-03-13
KOO, JUNMO
Executed: 2013-03-13
CAPARAS, JOSE ALVIN
Executed: 2013-03-13
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20, SINGAPORE, 569059, SINGAPORE
Covered Properties
(2)
Integrated Circuit Packaging System with Substrate and Method of Manufacture Thereof
Integrated Circuit Packaging System with Substrate and Method of Manufacture Thereof
Application:
61/655,431 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Corrective Assignment to Correct the Missing Non-Prov App Serial Number in Section 10 of Document Previously Recorded on Reel 030023 Frame 0017. Assignor(S) Hereby Confirms the Assignment.
Aug 1, 2013
From: LIN, YAOJIAN; SHIM, IL KWON; KOO, JUNMO; CAPARAS, JOSE ALVIN
To: STATS CHIPPAC LTD.
Reel/Frame 031078/0180 →
Security Interest
Nov 20, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 037096/0315 →
Change of Name
Jul 22, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 039428/0928 →
Release of Security Interest
Dec 13, 2019
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 051285/0318 →
Assignment of Assignor's Interest
Dec 18, 2019
From: STATS CHIPPAC PTE. LTD.
To: JCET SEMICONDUCTOR (SHAOXING) CO., LTD.
Reel/Frame 051365/0680 →