Integrated circuit packaging system with substrate and method of manufacture thereof
View Patent ↗An integrated circuit packaging system and method of manufacture thereof includes: a substrate having a top insulation layer and a top conductive layer; an inter-react layer on the substrate; an integrated circuit die on the substrate; a package body on the inter-react layer and the integrated circuit die; and a top solder bump on the top conductive layer, the top solder bump in a 3D via formed through the package body, the inter-react layer, and the top insulation layer for exposing the top conductive layer in the 3D via.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing an integrated circuit die;
encapsulating in a package body the integrated circuit die;
applying an inter-react layer on the package body;
forming a substrate on the inter-react layer, the substrate having a top insulation layer and a top conductive layer;
forming a 3D via through the package body, the inter-react layer, and the top insulation layer for exposing the top conductive layer in the 3D via; and
depositing a top solder bump in the 3D via on the top conductive layer.
2. The method as claimed in claim 1 further comprising applying a warpage balance layer on a top surface of the package body and the integrated circuit die.
3. The method as claimed in claim 1 wherein forming the 3D via through the package body, the inter-react layer, and the top insulation layer for exposing the top conductive layer in the 3D via includes:
forming a recess in the package body with an IR laser; and
forming a hole through a remaining portion of the package body, the inter-react layer, and the top insulation layer with a UV laser for exposing the top conductive layer.
4. The method as claimed in claim 1 further comprising attaching bottom connectors to the substrate.
5. The method as claimed in claim 1 wherein forming the 3D via includes forming the 3D via with a sidewall having a stepped multi-slope shape.
6. A method of manufacture of an integrated circuit packaging system comprising:
providing an integrated circuit die;
encapsulating in a package body the integrated circuit die;
applying an inter-react layer on the package body;
forming a substrate on the inter-react layer, the substrate having a top insulation layer and a top conductive layer;
applying a warpage balance layer on a top surface of the package body and the integrated circuit die;
forming a 3D via through the warpage balance layer, the package body, the inter-react layer, and the top insulation layer for exposing the top conductive layer in the 3D via; and
depositing a top solder bump in the 3D via on the top conductive layer.
7. The method as claimed in claim 6 wherein depositing the top solder bump on the top conductive layer includes depositing the top solder bump on a contact pad of the top conductive layer.
8. The method as claimed in claim 6 wherein forming a 3D via through the warpage balance layer, the package body, the inter-react layer, and the top insulation layer for exposing the top conductive layer in the 3D via includes:
forming a recess through the warpage balance layer and in the package body with an IR laser; and
forming a hole through a remaining portion of the package body, the inter-react layer, and the top insulation layer with a UV laser for exposing the top conductive layer.
9. The method as claimed in claim 6 forming a 3D via through the warpage balance layer, the package body, the inter-react layer, and the top insulation layer for exposing the top conductive layer in the 3D via includes:
forming a hole in the warpage balance layer with a UV laser;
forming a recess in the package body with an IR laser; and
forming a hole through a remaining portion of the package body, the inter-react layer, and the top insulation layer with the UV laser for exposing the top conductive layer.
10. The method as claimed in claim 6 further comprising connecting the integrated circuit die to the top conductive layer.
11. An integrated circuit packaging system comprising:
a substrate having a top insulation layer and a top conductive layer;
an inter-react layer on the substrate;
an integrated circuit die on the substrate;
a package body on the inter-react layer and the integrated circuit die; and
a top solder bump on the top conductive layer, the top solder bump in a 3D via formed through the package body, the inter-react layer, and the top insulation layer for exposing the top conductive layer in the 3D via.
12. The system as claimed in claim 11 further comprising a warpage balance layer on a top surface of the package body and the integrated circuit die.
13. The system as claimed in claim 11 wherein the 3D via has a sidewall having an uneven surface.
14. The system as claimed in claim 11 further comprising bottom connectors on the substrate.
15. The system as claimed in claim 11 wherein the 3D via has a sidewall having a stepped multi-slope shape.
16. The system as claimed in claim 11 further comprising:
a warpage balance layer on a top surface of the package body and the integrated circuit die; and
wherein:
the 3D via is formed through the warpage balance layer, the package body, the inter-react layer, and the top insulation layer for exposing the top conductive layer in the 3D via.
17. The system as claimed in claim 16 wherein the top conductive layer includes a contact pad in direct contact with the top solder bump.
18. The system as claimed in claim 16 wherein the 3D via has a sidewall having a steeper slope of an upper section than a slope of a lower section.
19. The system as claimed in claim 16 wherein the inter-react layer is transparent or semi-transparent.
20. The system as claimed in claim 16 wherein the integrated circuit die is connected to the top conductive layer.