IP Library › Patent Application 61804158
Patent Application Provisional
App. No. 61/804,158 · Confirmation No. 1392

CORE AND CARRIERLESS SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE THEREOF

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2014-06-19 APP.FILE.REC Filing Receipt 3 View
2014-06-16 PD.TO.AUTH Authorization or Rescission of Authorization to Access Application by Digital Access Service /Priority Document Exchange Office 2 View
2014-06-16 N417 Electronic Filing System Acknowledgment Receipt 2 View
2013-05-17 APP.FILE.REC Filing Receipt 3 View
2013-03-21 TR.PROV Provisional Cover Sheet (SB16) 4 View
2013-03-21 SPEC Specification 7 View
2013-03-21 CLM Claims 1 View
2013-03-21 ABST Abstract 1 View
2013-03-21 DRW.NONBW Drawings-other than black and white line drawings 9 View
2013-03-21 WFEE Fee Worksheet (SB06) 2 View
2013-03-21 N417 Electronic Filing System Acknowledgment Receipt 3 View
2013-03-21 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
0001-01-03 DRW.SUPP Drawings-black and white line and/or other drawings — View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
App. No.
61/804,158
Filed
2013-03-21